Patents by Inventor Jie-Mei Huang

Jie-Mei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating metal interconnects and inter-metal dielectric layer thereof
    Patent number: 7795131
    Abstract: A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: September 14, 2010
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Kuan-Jui Huang, Jie-Mei Huang, Chung-Hsiang Wang
  • METHOD OF FABRICATING METAL INTERCONNECTS AND INTER-METAL DIELECTRIC LAYER THEREOF
    Publication number: 20080146021
    Abstract: A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.
    Type: Application
    Filed: March 12, 2007
    Publication date: June 19, 2008
    Inventors: Kuan-Jui Huang, Jie-Mei Huang, Chung-Hsiang Wang