Abstract: A positive electrode material is provided, which includes: lithium manganese iron phosphate and carbon, the carbon is coated on the surface of the particle of the lithium manganese iron phosphate; the carbon accounts for 1.4% to 4.7% of the total mass of the positive electrode material. A preparation method of positive electrode material includes the following steps: after mixing and drying carbon source, manganese source, lithium source, iron source, doping element and phosphorus source, performing pre-sintering and pre-fusion at the first stage temperature, then increasing the temperature to the second stage temperature to continue sintering to obtain the positive electrode material. A positive electrode sheet is further provided, and a raw material for preparing the positive electrode sheet includes the positive electrode material described above.

Abstract: A semiconductor package structure includes a redistribution structure, a chip, an upper dielectric layer, a plurality of conductive members and an encapsulation layer. The redistribution structure includes a redistribution layer and a first dielectric layer disposed on the redistribution layer. The upper dielectric layer is disposed between the chip and the first dielectric layer of the redistribution structure, wherein the upper dielectric layer and the first dielectric layer are organic materials. A plurality of conductive members is disposed between the redistribution layer and the chip. Each conductive member has a first end adjacent to the chip and a second end adjacent to the redistribution structure, wherein the first end of said each conductive member contacts with the upper dielectric layer and the second end of said each conductive member contacts with the first dielectric layer.

Abstract: A redistribution layer structure of the semiconductor package includes a dielectric layer having a thickness, at least one upper conductive wire disposed on a first surface of the dielectric layer, at least one lower conductive wire disposed on a second surface of the dielectric layer, and vias penetrating the dielectric layer and connecting the at least one upper conductive wire and the at least one lower conductive wire. Each via has a cross-section at one upper conductive wire. The cross-section has a third width. The ratio of the third width to the thickness of the dielectric layer is less than or equal to 1. The ratio of the pitch between every two adjacent vias to the third width is greater than or equal to 0.5.

Abstract: A semiconductor package structure includes a redistribution structure, a chip, an upper dielectric layer, a plurality of conductive members and an encapsulation layer. The redistribution structure includes a redistribution layer and a first dielectric layer disposed on the redistribution layer. The upper dielectric layer is disposed between the chip and the first dielectric layer of the redistribution structure, wherein the upper dielectric layer and the first dielectric layer are organic materials. A plurality of conductive members is disposed between the redistribution layer and the chip. Each conductive member has a first end adjacent to the chip and a second end adjacent to the redistribution structure, wherein the first end of said each conductive member contacts with the upper dielectric layer and the second end of said each conductive member contacts with the first dielectric layer.

Abstract: A redistribution layer structure of the semiconductor package includes a dielectric layer having a thickness, at least one upper conductive wire disposed on a first surface of the dielectric layer, at least one lower conductive wire disposed on a second surface of the dielectric layer, and vias penetrating the dielectric layer and connecting the at least one upper conductive wire and the at least one lower conductive wire. Each via has a cross-section at one upper conductive wire. The cross-section has a third width. The ratio of the third width to the thickness of the dielectric layer is less than or equal to 1. The ratio of the pitch between every two adjacent vias to the third width is greater than or equal to 0.5.

Abstract: A connector includes a socket configured to be secured within a socket opening of a power input. A socket head has a plurality of plug insert receptacles. Each plug insert receptacle receives a conductive insert. The conductive insert connects with a cable that extends from the plug insert receptacle through and out of the socket. A plug contains a base. A head of the base has a plurality of plug insert units. Each plug insert unit receives a conductive insert that connects with a cable that extends out the base of the plug. A handle covers the base. The handle and the base are fixed and connected by a positioning device that includes an inverted tooth structure. The socket and plug when connected are secured in place by an elastic hasp.

Abstract: A power distributor includes an upper cover with an inverted U-shaped cross-section, a plurality of output power sockets being located along a longitudinal direction of the upper cover. The power distributor also includes a lower cover with a U-shaped cross-section. The lower cover is engaged with the upper cover to form housing for the power distributor. The upper cover is composed of several modular cover units that are interconnected with each other. Each modular cover unit includes stepped connecting parts that connect to stepped connecting parts of adjacent modular cover units. The lower cover includes a slidable hanging mechanism. A front end of the housing is provided with an input power connector.

Abstract: A connector includes a socket configured to be secured within a socket opening of a power input. A socket head has a plurality of plug insert receptacles. Each plug insert receptacle receives a conductive insert. The conductive insert connects with a cable that extends from the plug insert receptacle through and out of the socket. A plug contains a base. A head of the base has a plurality of plug insert units. Each plug insert unit receives a conductive insert that connects with a cable that extends out the base of the plug. A handle covers the base. The handle and the base are fixed and connected by a positioning device that includes an inverted tooth structure. The socket and plug when connected are secured in place by an elastic hasp.

Abstract: An anti-disengaging mechanism of a cable connector includes a power connector having a jack opening. The power connector also has a metal electrode and a ring buckle located within the jack opening. A plug has a plug pin. When the plug pin is inserted into the jack opening, the ring buckle surrounds the plug pin. A longitudinal sliding pushrod is set in the power connector so that when the longitudinal sliding pushrod is in a first position, the longitudinal sliding pushrod tilts the ring buckle so as to lock the plug pin in the jack opening. When the longitudinal sliding pushrod is in a second position, the ring buckle releases the plug pin.

Abstract: An anti-disengaging mechanism of a cable connector includes a power connector having a jack opening. The power connector also has a metal electrode and a ring buckle located within the jack opening. A plug has a plug pin. When the plug pin is inserted into the jack opening, the ring buckle surrounds the plug pin. A longitudinal sliding pushrod is set in the power connector so that when the longitudinal sliding pushrod is in a first position, the longitudinal sliding pushrod tilts the ring buckle so as to lock the plug pin in the jack opening. When the longitudinal sliding pushrod is in a second position, the ring buckle releases the plug pin.