Abstract: A device to sense degree of twist in a screwdriver and the magnitude of force applied includes a contacting portion, a deformation portion, a sensing portion, and a processor. The contacting portion receives a grip and twist pressure through the deformation portion which is tiltedly fixed to the contacting portion. The deformation portion carries the sensing portion and elastically deforms under the force and/or the torsion. The sensing portion detects a deformation of the deformation portion and generates a corresponding electrical signal. The processor receives the signal and determines the values of the twist caused and the force applied.

Abstract: A speed reducer includes an input shaft, an output shaft, and a gear assembly coupled to the input shaft. The gear assembly includes a housing, an external gear, and at least two internal gears. The external gear is located within the housing and inscribes the at least two internal gears. One side of the at least two internal gears is rotatably coupled to the input shaft, and another side of the at least two internal gears is coupled to a connecting column of the output shaft. The at least two internal gears are offset on the input shaft, and the input shaft drives the at least two internal gears to maintain engagement with the external gear. The connecting column maintains transmission of the output shaft and the at least two internal gears.

Abstract: A device to sense degree of twist in a screwdriver and the magnitude of force applied includes a contacting portion, a deformation portion, a sensing portion, and a processor. The contacting portion receives a grip and twist pressure through the deformation portion which is tiltedly fixed to the contacting portion. The deformation portion carries the sensing portion and elastically deforms under the force and/or the torsion. The sensing portion detects a deformation of the deformation portion and generates a corresponding electrical signal. The processor receives the signal and determines the values of the twist caused and the force applied.

Abstract: A speed reducer includes an input shaft, an output shaft, and a gear assembly coupled to the input shaft. The gear assembly includes a housing, an external gear, and at least two internal gears. The external gear is located within the housing and inscribes the at least two internal gears. One side of the at least two internal gears is rotatably coupled to the input shaft, and another side of the at least two internal gears is coupled to a connecting column of the output shaft. The at least two internal gears are offset on the input shaft, and the input shaft drives the at least two internal gears to maintain engagement with the external gear. The connecting column maintains transmission of the output shaft and the at least two internal gears.

Abstract: A machine for testing the parts and functions of a mobile phone includes a supporting mechanism, a platform, a receiving portion, and a detecting mechanism. The supporting mechanism is mounted in a box. The platform is slidably mounted on the supporting mechanism. The receiving portion is used to receive the mobile phone. The receiving portion is rotatably mounted on the platform. Devices within the machine are operated to test the mobile phone. A mobile phone testing system used in the testing machine is also described.

Abstract: A system for evaluating all functions of a mobile phone to benefit recycling purposes includes a robotic arm assembly, a camera test device, a touch test device, and a 3D Touch test device. The camera test device has a backlight screen and a target picture. The touch test device has at least one first stylus for applying input to a touch screen of a mobile phone. The 3D Touch test device has at least one second stylus for applying strong presses to the touch screen of the mobile phone. The robotic arm assembly can also move the mobile phone to enable image-capturing. A method for functionality-testing is also provided.

Abstract: A testing apparatus for testing a circuit board is disclosed, which includes an upper plate, a lower plate, and an adaptor circuit board. A plurality of positioning units is received in the lower plate. Each positioning unit has a plurality of length-variable test probes secured therein. Each test probe has a shell and upper and lower probe ends at opposite ends of the shell. In test, the circuit board is put on the lower plate and the upper plate is lowered to push the circuit board and the lower plate toward the adaptor circuit board. The upper ends of the test probes engage with electrical connectors of the circuit board and the lower ends thereof engage with the adaptor circuit board whereby test of the circuit board can be automatically performed by the testing apparatus.

Abstract: A machine for testing the parts and functions of a mobile phone includes a supporting mechanism, a platform, a receiving portion, and a detecting mechanism. The supporting mechanism is mounted in a box. The platform is slidably mounted on the supporting mechanism. The receiving portion is used to receive the mobile phone. The receiving portion is rotatably mounted on the platform. Devices within the machine are operated to test the mobile phone. A mobile phone testing system used in the testing machine is also described.

Abstract: A testing apparatus for testing a circuit board is disclosed, which includes an upper plate, a lower plate, and an adaptor circuit board. A plurality of positioning units is received in the lower plate. Each positioning unit has a plurality of length-variable test probes secured therein. Each test probe has a shell and upper and lower probe ends at opposite ends of the shell. In test, the circuit board is put on the lower plate and the upper plate is lowered to push the circuit board and the lower plate toward the adaptor circuit board. The upper ends of the test probes engage with electrical connectors of the circuit board and the lower ends thereof engage with the adaptor circuit board whereby test of the circuit board can be automatically performed by the testing apparatus.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.