Abstract: The present invention provides a heat-conducting flame-retardant material, wherein the heat-conducting flame-retardant material is a liquid state, colloidal state, or a semisolid state, and comprises: silicon dioxide, which accounts for 10-85% of the entire weight; a reactant, which has crosslinking properties and foaming reactivity, and is mixed with the silicon dioxide; and a catalyst, which is a temperature active or photoactive catalyst, and when mixed with the reactant triggers a foaming reaction of the reactant. Before a foaming reaction of the reactant occurs, the heat-conducting flame-retardant material has heat conductivity properties, and is provided with flame retardant characteristics after a foaming reaction of the reactant occurs.

Abstract: The present invention provides thermal interface materials for the interior, center, and exterior of an electronic component, wherein the interior thereof is a first contact interface between an electronic chip and an integrated heat spreader; the center thereof is a second contact interface between the electronic chip and a heatsink; and the exterior thereof is a third contact interface between the integrated heat spreader and the heatsink. The thermal interface material consists of: a first, a second, a third thermal conductive adhesive layer, along with a thin electrically conductive functional layer. The thin electrically conductive functional layer is at least a conductive foil, a conductive foil with a ceramic and/or graphene heat dissipation layer on one side thereof, and a conductive foil with a ceramic and/or graphene heat dissipation layer on two sides thereof; and is laminated between the first and the second thermal conductive adhesive layer.

Abstract: The present invention provides thermal interface materials for the interior, center, and exterior of an electronic component, wherein the interior thereof is a first contact interface between an electronic chip and an integrated heat spreader; the center thereof is a second contact interface between the electronic chip and a heatsink; and the exterior thereof is a third contact interface between the integrated heat spreader and the heatsink. The thermal interface material consists of: a first, a second, a third thermal conductive adhesive layer, along with a thin electrically conductive functional layer. The thin electrically conductive functional layer is at least a conductive foil, a conductive foil with a ceramic and/or graphene heat dissipation layer on one side thereof, and a conductive foil with a ceramic and/or graphene heat dissipation layer on two sides thereof; and is laminated between the first and the second thermal conductive adhesive layer.

Abstract: The present invention provides a heat dissipation conductive flexible board, which is assembled from: at least a single layer thin board, the structure of which includes a first conductive thin layer and a first functional thin layer, and at least a double layer thin board, the structure of which includes a second conductive thin layer, a second functional thin layer, and a third functional thin layer. A spraying, coating, or printing method is used to manufacture the single layer thin board and the double layer thin board; after which the single layer thin board and the double layer thin board are laminated together to form the heat dissipation conductive flexible board having a multi-layer conductive structure.

Abstract: A thin encapsulating attachment structure, consisting of a first thin film portion, which is provided with two surfaces, wherein one of the surfaces is partially or completely contiguously attached to an attachment portion; and a second thin film portion, which is provided with two surfaces, wherein one of the surfaces is partially or completely contiguously attached to the attachment portion. The attachment portion, which is positioned between the first thin film portion and the second thin film portion, and is a binding agent composed of at least an epoxy resin, a silicone resin, polyester, polyurethane, nano silicate, or a nano titanium, the thickness range of the attachment portion is 0.5˜100 micrometers. The first thin film portion, the attachment portion, and the second thin film portion are assembled to form the thin encapsulating attachment structure, the thickness of which is less than or equal to 200 micrometers.

Abstract: The present invention provides a heat dissipation conductive flexible board, which is assembled from: at least a single layer thin board, the structure of which includes a first conductive thin layer and a first functional thin layer, and at least a double layer thin board, the structure of which includes a second conductive thin layer, a second functional thin layer, and a third functional thin layer. A spraying, coating, or printing method is used to manufacture the single layer thin board and the double layer thin board; after which the single layer thin board and the double layer thin board are laminated together to form the heat dissipation conductive flexible board having a multi-layer conductive structure.