Patents by Inventor Jie Wie

Jie Wie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6404640
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: June 11, 2002
    Assignee: Fujitsu Limited
    Inventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wie, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki