Patents by Inventor Jie Zou

Jie Zou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128542
    Abstract: A battery pack includes a battery body, a housing, and a heat sink. The housing surrounds a part of the surface of the battery body. The heat sink is disposed on the housing. A bottom surface of the heat sink abuts against a bus board disposed on the upper end of the battery body, and the heat sink is in thermal contact with a module electrode at the upper end of the battery body. In the battery pack provided by the present application, heat dissipation around the battery body could be achieved, heat generated by a tab or heat conducted by the battery body to the tab could also be guided outwards, so that all-round heat dissipation around the battery pack is achieved. The battery pack provided by the present application is suitable for the unmanned aerial vehicle and meets the high heat dissipation requirement.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: ZHUHAI COSMX POWER BATTERY CO., LTD.
    Inventors: Zhiguo ZHANG, Xuping ZOU, Jiafan WU, Jie LI, Changquan LIN
  • Patent number: 11962283
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: April 16, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Publication number: 20240063768
    Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) filter device is provided. The method includes: forming a first electrode of each one of a first resonator and a second resonator on a first surface of a piezoelectric layer, forming a first passivation layer of each one of the first resonator and the second resonator on a corresponding one of the first electrodes, forming a second electrode of each one of the first resonator and the second resonator on a second surface of the piezoelectric layer, conducting a radio frequency (RF) performance test on the FBAR filter device, adjusting a thickness of the second electrode of the first resonator based on a result of the RF performance test, and forming a second passivation layer of each one of the first resonator and the second resonator on a corresponding one of the second electrodes.
    Type: Application
    Filed: September 25, 2023
    Publication date: February 22, 2024
    Inventors: Jian WANG, Jie ZOU, Gongbin TANG
  • Patent number: 11841937
    Abstract: Techniques for providing a data confidence index are presented herein. In one embodiment, a method includes setting a default confidence index for a remote computing device, the confidence index indicating trustworthiness of data provided by the remote computing device, the remote computing device operating as part of a network of cooperating devices; applying a plurality of ordered rules for the remote computing device, respective rules comprising a rule pre-condition and a confidence index adjustment, respective rules considering one of a behavior of the remote computing device and a property of the remote computing device; and adjusting the confidence index for the remote computing device responsive to results of applying the plurality of ordered rules. A system and apparatus substantially perform steps of the disclosed method.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: December 12, 2023
    Assignee: PayPal, Inc.
    Inventors: Suneet Nandwani, Jie Zou
  • Publication number: 20230244892
    Abstract: An example method includes receiving images that each include an optical code. The method further includes cropping the images to isolate the optical codes and rotating the images to achieve a desired orientation for the optical code of each of the images. The method further includes rectifying, after the cropping and the rotating, a perspective of each of the images to achieve a desired perspective angle for the optical code of each of the images. The method further includes deblurring, after the rectifying, the images to reduce blurring in each of the images. The method further includes binarizing, after the deblurring, the images to correct pixels of the optical code in each of the images. The method further includes performing, after the binarizing, an optical code reading process on the plurality of images to decode optical codes in the images.
    Type: Application
    Filed: February 3, 2022
    Publication date: August 3, 2023
    Inventors: Jie Zou, Wendi Lin, Fangyi Zou
  • Publication number: 20230099342
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Application
    Filed: December 1, 2022
    Publication date: March 30, 2023
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Patent number: 11522514
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: December 6, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Publication number: 20220014170
    Abstract: Aspects of this disclosure relate to an acoustic wave filter configured to filter a radio frequency signal and a loop circuit coupled to the acoustic wave filter. The loop circuit is configured to generate an anti-phase signal to a target signal at a particular frequency. The loop circuit includes a Lamb wave element. Related radio frequency modules and wireless communication devices are disclosed.
    Type: Application
    Filed: September 28, 2021
    Publication date: January 13, 2022
    Inventors: Chih-Ming Lin, Jie Zou, Toru Jibu, Chun Sing Lam, Joshua James Caron
  • Patent number: 11165406
    Abstract: Aspects of this disclosure relate to an acoustic wave device that includes a bulk acoustic wave resonator and a Lamb wave element implemented on a common substrate. In some instances, the bulk acoustic wave resonator can be a film bulk acoustic wave resonator. Related radio frequency modules and wireless communication devices are disclosed.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 2, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Chih-Ming Lin, Jie Zou, Toru Jibu, Chun Sing Lam, Joshua James Caron
  • Patent number: 11126301
    Abstract: A power adapter control method is provided. The method includes: obtaining a scanning frequency of the TP and a strength of common mode noise generated by a power adapter at the scanning frequency of the TP; determining whether the strength of the common mode noise is greater than or equal to a preset threshold; and when the strength of the common mode noise is greater than or equal to the preset threshold, adjusting a working frequency of a control IC of the power adapter, so that a strength of common mode noise newly generated by the power adapter at the scanning frequency of the TP is less than the preset threshold. The embodiments of the present invention are used for a process of reducing interference of the common mode noise to the TP.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: September 21, 2021
    Assignee: Honor Device Co., Ltd.
    Inventors: Jie Zou, Lianming Zhang, Wenfeng Wang
  • Publication number: 20210099153
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Application
    Filed: December 10, 2020
    Publication date: April 1, 2021
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Publication number: 20210050840
    Abstract: Aspects of this disclosure relate to an elastic wave device. The elastic wave device includes a sub-wavelength thick piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a high velocity layer configured to inhibit an elastic wave from leaking from the piezoelectric layer at anti-resonance.
    Type: Application
    Filed: August 3, 2020
    Publication date: February 18, 2021
    Inventors: Rei Goto, Jie Zou, Hiroyuki Nakamura, Chun Sing Lam
  • Patent number: 10873313
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: December 22, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Patent number: 10778181
    Abstract: Aspects of this disclosure relate to an elastic wave device. The elastic wave device includes a sub-wavelength thick piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a high velocity layer configured to inhibit an elastic wave from leaking from the piezoelectric layer at anti-resonance.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: September 15, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Rei Goto, Jie Zou, Hiroyuki Nakamura, Chun Sing Lam
  • Publication number: 20200279040
    Abstract: Techniques for providing a data confidence index are presented herein. In one embodiment, a method includes setting a default confidence index for a remote computing device, the confidence index indicating trustworthiness of data provided by the remote computing device, the remote computing device operating as part of a network of cooperating devices; applying a plurality of ordered rules for the remote computing device, respective rules comprising a rule pre-condition and a confidence index adjustment, respective rules considering one of a behavior of the remote computing device and a property of the remote computing device; and adjusting the confidence index for the remote computing device responsive to results of applying the plurality of ordered rules. A system and apparatus substantially perform steps of the disclosed method.
    Type: Application
    Filed: January 7, 2020
    Publication date: September 3, 2020
    Inventors: Suneet Nandwani, Jie Zou
  • Patent number: 10756000
    Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: August 25, 2020
    Assignee: Huawei Device Co., Ltd.
    Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
  • Publication number: 20200083144
    Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 12, 2020
    Inventors: Linfang JIN, Yongwang XIAO, Guoping WANG, Jie Zou, Hualin LI
  • Patent number: 10528718
    Abstract: Techniques for providing a data confidence index are presented herein. In one embodiment, a method includes setting a default confidence index for a remote computing device, the confidence index indicating trustworthiness of data provided by the remote computing device, the remote computing device operating as part of a network of cooperating devices; applying a plurality of ordered rules for the remote computing device, respective rules comprising a rule pre-condition and a confidence index adjustment, respective rules considering one of a behavior of the remote computing device and a property of the remote computing device; and adjusting the confidence index for the remote computing device responsive to results of applying the plurality of ordered rules. A system and apparatus substantially perform steps of the disclosed method.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: January 7, 2020
    Assignee: PAYPAL, INC.
    Inventors: Suneet Nandwani, Jie Zou
  • Patent number: 10497641
    Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: December 3, 2019
    Assignee: HUAWEI DEVICE CO., LTD.
    Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
  • Patent number: 10481654
    Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: November 19, 2019
    Assignee: Huawei Device Co., Ltd.
    Inventors: Xiangyang Yang, Linfang Jin, Hualin Li, Wenbing Tang, Jie Zou