Patents by Inventor Jieh-Chau HUANG

Jieh-Chau HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER CLEANING APPARATUS AND METHOD
    Publication number: 20240021446
    Abstract: The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jieh-Chau HUANG, Ying Ting Hsia, Ping-Jung Huang, Pei Yen Hsia, Bi-Ming Yen, Hung-Lung Hu
  • Wafer cleaning apparatus and method
    Patent number: 11764081
    Abstract: The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jieh-Chau Huang, Bi-Ming Yen, Hung-Lung Hu, Ying Ting Hsia, Ping-Jung Huang, Pei Yen Hsia
  • WAFER CLEANING APPARATUS AND METHOD
    Publication number: 20210313200
    Abstract: The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
    Type: Application
    Filed: June 17, 2021
    Publication date: October 7, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jieh-Chau HUANG, Bi-Ming YEN, Hung-Lung HU, Ying Ting HSIA, Ping-Jing HUANG, Pei Yen HSIA
  • Wafer cleaning apparatus and method
    Patent number: 11056358
    Abstract: The present disclosure describes an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: July 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jieh-Chau Huang, Bi-Ming Yen, Hung-Lung Hu, Ying Ting Hsia, Ping-Jung Huang, Pei Yen Hsia
  • WAFER CLEANING APPARATUS AND METHOD
    Publication number: 20190148181
    Abstract: The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
    Type: Application
    Filed: August 10, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jieh-Chau HUANG, Bi-Ming YEN, Hung-Lung HU, Ying Ting HSIA, Ping-Jung HUANG, Pei Yen HSIA