Abstract: The present invention provides a PA10T molding composite material that can be used to produce LED display light source reflection supports. The width of the crystallization peak at half maximum ?T1/2 is adjusted to be 3-10° C., the whiteness is adjusted to be less than 26, and the 460 nm light source reflectivity is adjusted to be less than 6.5%, such that the PA 10T molding composite material has the advantages of low blue light, high contrast, and high gray scale, and can satisfy requirements for a packaging process and long-term reliability, and can be used as a packaging product to manufacture high-contrast LED display light source refection supports applicable in multiple scenarios.

Abstract: Disclosed is a furan diacid-based polyamide resin, which is derived from the following repeating units: (A) 2,5-furandicarboxylic acid, (B) 1,4-cyclohexanedicarboxylic acid, and (C) 1,10-decanediamine, where based on the total molar percentage of the diacid units, (A) accounts for 5-45 mol % of the diacid units.

Abstract: The present invention provides a semi-aromatic polyamide molding composite material that can be used for producing an LED display screen light source reflection support. Generally, by selecting a semi-aromatic polyamide resin having a specific repeating unit, and enabling the crystallization peak width at half maximum ?T1/2 to be 4-11° C., the whiteness to be less than 26.5, the reflectivity under a 460 nm light source to be less than 6% etc., the semi-aromatic polyamide molding composite material has the advantages of reduced blue light, high contrast ratio and high gray scale, and can meet requirements for the packaging process and long-term reliability. The package product can be used for manufacturing high-contrast LED display screen light source refection supports for use in multiple environments.

Abstract: The present invention discloses a furan diacid-based polyamide, which is derived from the following repeating units: (A) 2,5-furandicarboxylic acid, (B) 1,4-cyclohexanedicarboxylic acid, and (C) 1,5-pentanediamine, where based on the total molar percentage of the diacid units, (A) accounts for 10-45 mol % of the diacid units. The furan diacid-based polyamide of the present invention has a melting point of 291-335° C.

Abstract: The present invention discloses a semiaromatic polyamide resin, a preparation method thereof, and a polyamide molding composition consisting of the same, which consists of following components: (A) 20 to 95 wt % of a PA10T homopolymer derived from 1,10-decanediamine and terephthalic acid; and (B) 5 to 80 wt % of a PA6T homopolymer derived from 1,6-hexanediamine and terephthalic acid. Particularly, (A)+(B)=100 wt %. In the present invention, by adding a certain amount of the PA10T homopolymer into the PA6T homopolymer, a melting point of the PA6T homopolymer can be significantly decreased to be below a decomposition temperature thereof, and thereby a processability of the PA6T homopolymer is improved. The prepared semiaromatic polyamide resin has a decreased melting point, and may be processed normally. The polyamide molding composition consisting of the semiaromatic polyamide resin has a good processability, and has excellent surface properties.

Abstract: Disclosed are a halogen-free fire-retardant polyamide composition, and a preparation method and application thereof. The halogen-free fire-retardant polyamide composition is prepared from 35 to 71.5% of a semi-aromatic polyamide, 10 to 35% of a fire retardant and 0 to 50% of an inorganic reinforcing filler, the terminal amino group content of the semi-aromatic polyamide being 80 to 150 mol/t. The halogen-free fire-retardant polyamide composition of the present invention has good heat stability and releases only a small amount of gas in production; mold dirt is not easily formed, and the halogen-free fire-retardant polyamide composition can be produced continuously.

Abstract: The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition.

Abstract: Disclosed are a halogen-free fire-retardant polyamide composition, and a preparation method and application thereof. The halogen-free fire-retardant polyamide composition is prepared from 35 to 71.5% of a semi-aromatic polyamide, 10 to 35% of a fire retardant and 0 to 50% of an inorganic reinforcing filler, the terminal amino group content of the semi-aromatic polyamide being 80 to 150 mol/t. The halogen-free fire-retardant polyamide composition of the present invention has good heat stability and releases only a small amount of gas in production; mold dirt is not easily formed, and the halogen-free fire-retardant polyamide composition can be produced continuously.

Abstract: The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to I% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition.