Patents by Inventor Jieping Guo

Jieping Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10625691
    Abstract: The application belongs to the technical field of automobile plated part, and in particular relates to an automobile, an automobile plated part, an automobile plated part mold and a manufacturing method thereof. The method for manufacturing automobile plated part mold comprises the steps of: establishing a first simulation model of the automobile plated part mold based on a set shape of the substrate of the automobile plated part; using the first simulation model to simulate injection process of the substrate to obtain a first simulation substrate; performing at least one modification processing on the first simulation model, so that a second simulation model thus obtained satisfies the following requirements: using the second simulation model to simulate the injection process of the substrate to obtain a second simulation substrate conforming to the set shape; manufacturing the automobile plated mold according to the second simulation model.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: April 21, 2020
    Assignee: NIO CO., LTD.
    Inventors: Wei Wu, Wenhai Lu, Qihua Zhang, Jieping Guo, Gary Denton
  • Publication number: 20180290604
    Abstract: The application belongs to the technical field of automobile plated part, and in particular relates to an automobile, an automobile plated part, an automobile plated part mold and a manufacturing method thereof. The method for manufacturing automobile plated part mold comprises the steps of: establishing a first simulation model of the automobile plated part mold based on a set shape of the substrate of the automobile plated part; using the first simulation model to simulate injection process of the substrate to obtain a first simulation substrate; performing at least one modification processing on the first simulation model, so that a second simulation model thus obtained satisfies the following requirements: using the second simulation model to simulate the injection process of the substrate to obtain a second simulation substrate conforming to the set shape; manufacturing the automobile plated mold according to the second simulation model.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 11, 2018
    Inventors: Wei WU, Wenhai LU, Qihua ZHANG, Jieping GUO, Gary DENTON
  • Patent number: 9915991
    Abstract: A power state management system of an electronic system is coupled to a plug load device and a method for operation of the same. The system includes a context clock to adjust a duty cycle of the electronic system for controlling the power states of the electronic system for more efficient use of electricity. The context clock is responsive to user input, multiple event driven activities or an external protocol determined policy or command. Interface circuitry communicates user input, multiple event driven activities or an external protocol determined policy or command to the context clock. Interface circuitry also communicates commands to the managed plug load device or devices.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: March 13, 2018
    Assignee: The Regents of the University of California
    Inventors: Yang Arthur Zhang, Guann Pyng Li, Zachary Davis, Christopher Hurst, Jieping Guo
  • Publication number: 20160011636
    Abstract: A power state management system of an electronic system is coupled to a plug load device and a method for operation of the same. The system includes a context clock to adjust a duty cycle of the electronic system for controlling the power states of the electronic system for more efficient use of electricity. The context clock is responsive to user input, multiple event driven activities or an external protocol determined policy or command. Interface circuitry communicates user input, multiple event driven activities or an external protocol determined policy or command to the context clock. Interface circuitry also communicates commands to the managed plug load device or devices.
    Type: Application
    Filed: March 14, 2014
    Publication date: January 14, 2016
    Inventors: Yang Arthur Zhang, Guann Pyng Li, Zachary Davis, Christopher Hurst, Jieping Guo