Patents by Inventor Jieun Ko

Jieun Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220298279
    Abstract: A resin composition of an embodiment includes a (meth)acrylate monomer, a photoinitiator, and a moisture absorbent, wherein the moisture absorbent includes a hydrolysable group, and a carboxyl group after hydrolysis, thereby providing a display device with improved tolerance to moisture and moisture permeability.
    Type: Application
    Filed: December 10, 2021
    Publication date: September 22, 2022
    Inventors: WONMIN YUN, Jieun KO, YOHAN KIM, YISU KIM, BYOUNGDUK LEE, SEUNGJU LEE, JAEHYUK LEE, Hyungdong LEE, YOONHYEUNG CHO, HYEONSEO CHO
  • Publication number: 20220285651
    Abstract: An encapsulation structure includes an organic encapsulation layer. The organic encapsulation layer includes a base resin and hygroscopic composite particles including a hygroscopic composite particle. The hygroscopic composite particle includes a core and a silica layer around the core. The core includes a polymer. The silica layer includes silica.
    Type: Application
    Filed: October 28, 2021
    Publication date: September 8, 2022
    Inventors: Jieun Ko, YOHAN KIM, YISU KIM, WONMIN YUN, BYOUNGDUK LEE, SEUNGJU LEE, JAEHYUK LEE, Hyungdong Lee, YOONHYEUNG CHO, HYEONSEO CHO