Abstract: Provided are a thermoplastic resin composition and a molded product using same, wherein the thermoplastic resin composition includes a base resin including (A-1) 10 wt % to 30 wt % of a first acrylate-based graft copolymer having an acrylate-based rubbery polymer with an average particle diameter of 300 nm to 400 nm; (A-2) 10 wt % to 35 wt % of a second acrylate-based graft copolymer having an acrylate-based rubbery polymer with an average particle diameter of 100 nm to 200 nm; (B) 10 wt % to 15 wt % of an aromatic vinyl compound-vinyl cyanide compound copolymer; and (C) 35 wt % to 55 wt % of ?-methylstyrene-based copolymer, and (D) 1 to 5 parts by weight of an ultrahigh molecular weight styrene-acrylonitrile copolymer having a weight average molecular weight of greater than or equal to 5,000,000 g/mol, based on 100 parts by weight of the base resin.

Abstract: A semiconductor device has a substrate and first electrical component disposed over the substrate. A first shielding layer is disposed over the first electrical component. A first film material is disposed between the first electrical component and first shielding layer for selective attachment of the first shielding layer. A second electrical component can be disposed over the substrate. A second shielding layer is disposed over the second electrical component, and a second film material disposed between the second electrical component and second shielding layer. A third shielding layer can be disposed over the first shielding layer, and a third film material disposed between the first shielding layer and third shielding layer. A fourth film material can be disposed between the first electrical component and substrate. An encapsulant is deposited over the first electrical component and substrate. A fourth shielding layer is formed over the encapsulant.

Abstract: A semiconductor device has a sacrificial substrate and an electrical component disposed over the sacrificial substrate. A bump stop layer is formed within the sacrificial substrate. At least a portion of the bump or terminal of the electrical component is embedded into the sacrificial substrate to contact the bump stop layer. An encapsulant is deposited over the electrical component and sacrificial substrate. A channel is formed through the encapsulant and partially into the sacrificial substrate. The sacrificial substrate is removed to leave a bump or terminal of the electrical component extending out from the encapsulant. A thickness of the semiconductor device is determined by a thickness of the encapsulant and bump extending out from the encapsulant. A portion of the encapsulant can be removed to reduce the thickness of the semiconductor device. A conductive paste can be deposited over the bump or terminal extending out from the encapsulant.

Abstract: A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a first surface and a second surface opposite to the first surface; a first electronic component mounted on the first surface of the substrate; a second electronic component mounted on the second surface; and a contact pad formed on the second surface of the substrate, wherein the contact pad is outside of a projection of the second electronic component on the second surface of the substrate; and a first encapsulant disposed on the first surface of the substrate and covering the first electronic component; forming a second encapsulant over and around the second electronic component, wherein the contact pad is exposed from the second encapsulant; planarizing the second encapsulant to expose the second electronic component; and forming a bump on the contact pad of the second surface of the substrate.

Abstract: A method of manufacturing a biocompatible polymer-based microneedle, the method comprising: (a) a primary filling step of covering, by stoppers, upper sides of multiple holes, which are formed to be spaced apart from one another, penetrate a mold, and each have a conical shape, and injecting a biocompatible polymer solution containing an appropriate amount of active ingredient by using filling needles; (b) a secondary filling step of injecting a biocompatible polymer solution containing an excipient by using the filling needles; (c) a step of solidifying the biocompatible polymer solution; and (d) a step of attaching a pad to an upper portion of the mold and then detaching the pad from the mold. The microneedle manufactured by the present invention may solve problems of degeneration of medicine, insufficient hardness, and a loss of medicine caused by a complicated process and a long manufacturing time.

Abstract: A method of manufacturing a biocompatible polymer-based microneedle, the method comprising: (a) a primary filling step of covering, by stoppers, upper sides of multiple holes, which are formed to be spaced apart from one another, penetrate a mold, and each have a conical shape, and injecting a biocompatible polymer solution containing an appropriate amount of active ingredient by using filling needles; (b) a secondary filling step of injecting a biocompatible polymer solution containing an excipient by using the filling needles; (c) a step of solidifying the biocompatible polymer solution; and (d) a step of attaching a pad to an upper portion of the mold and then detaching the pad from the mold. The microneedle manufactured by the present invention may solve problems of degeneration of medicine, insufficient hardness, and a loss of medicine caused by a complicated process and a long manufacturing time.