Patents by Inventor Jieyun Jiang

Jieyun Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and electronic apparatus thereof
    Patent number: 8927878
    Abstract: Embodiments of a printed circuit board (PCB) and an electronic apparatus are provided. The PCB includes a PCB substrate and a plurality of the pads. The PCB substrate is disposed with the plurality of the pads. The plurality of the pads include a first type of the pads and a second type of the pads. The first type of the pads adopts the solder mask defined structure, and the second type of the pads adopts the non-solder mask defined structure.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: January 6, 2015
    Assignee: MediaTek Singapore Pte. Ltd
    Inventors: Jieyun Jiang, Shih-Chin Lin, Fu-Kang Pan, Yang Liu, Hung-Chang Hung