Abstract: A unidirectional transient voltage suppression (TVS) device. The TVS device may include a first layer, comprising an N+ material, formed on a first part of a first main surface of a substrate and a second layer formed from an N? material. The second layer may extend from a second part of the first main surface, surrounding the first layer, and may extend subjacent to the first layer. The TVS device may include a third layer, comprising a P+ material, wherein the second layer is disposed between the first layer and the third layer. The TVS device may also include an isolation region, extending from the first main surface, and being disposed around the second layer.

Abstract: A transient voltage suppression (TVS) device. The TVS device may include a substrate, comprising a polarity of a first type. The TVS device may further include a first dopant layer, disposed on a first surface of the substrate, the first layer comprising a polarity of a second type, wherein the first dopant layer forms a P/N junction with the substrate. The TVS device may include a first buffer layer, disposed on the first dopant layer, and a first outer contact layer, disposed on the first buffer layer.

Abstract: A TVS device may include a substrate, comprising a polarity of a first type, a first dopant layer, disposed on a first main surface of the substrate, and comprising a polarity of a second type, wherein the first dopant layer forms a P/N junction with the substrate. The TVS device may further include a second dopant layer, disposed on a second main surface of the substrate, opposite the first main surface, the second layer comprising the polarity of the first type, and a patterned layer, disposed on the second main surface of the substrate, the patterned layer comprising the polarity of the second type, wherein the patterned layer is interspersed with the second layer.

Abstract: A lead frame package includes a first semiconductor chip, a second semiconductor chip, and a first lead frame. The first semiconductor chip is connected to a die attachment pad using a first clip. The second semiconductor chip is connected to the die attachment pad using a second clip. The die attachment pad is sandwiched between the first semiconductor chip and the second semiconductor chip. The first lead frame is connected to the die attachment pad.

Abstract: A discrete power semiconductor package includes a semiconductor chip, a heatsink, a first lead, a second lead, and a clip. The heatsink is adjacent the semiconductor chip and draws heat away from the semiconductor chip. The clip binds the semiconductor chip to the heatsink and includes a chip linker, a first terminal, and a second terminal. The chip linker is atop the semiconductor chip. The first terminal connects to the first lead and the second terminal connects to the second lead.

Abstract: A discrete semiconductor package includes a semiconductor device, a left lead, and a right lead. The semiconductor device has a first side and a second side, the second side being opposite the first side. The left lead has a left terminal and a platform to support the semiconductor device on the first side. The right lead has a right terminal and a clip coin to support the semiconductor device on the second side.

Abstract: An online upgrade method for a household appliance multi-MCU system includes: sending to a server an online upgrade request and a version of the current program upgrade package. The program upgrade package includes an upgrade program of a main MCU and an upgrade program of at least one secondary MCU. The method includes receiving a latest program upgrade package from the server; reading and parsing the latest program upgrade package, and determining whether the main MCU and the secondary MCU needing program upgrade based on header information of the latest program upgrade package; upgrading the main MCU needing program upgrade based on a determination result, sending to the corresponding secondary MCU an upgrade program of the secondary MCU needing upgrade based on the determination result. The multi-MCU system includes a unique software version number, providing convenient version maintenance and tracing, providing a high software upgrade stability for the system.

Abstract: A protection device may include a semiconductor substrate and a thyristor-type device, formed within the semiconductor substrate, where the thyristor device extends from a first main surface of the semiconductor substrate to a second main surface of the semiconductor substrate. The protection device may include a first PN diode, formed within the semiconductor substrate; and a second PN diode, formed within the semiconductor substrate, wherein the thyristor-type device is arranged in electrical series between the first PN diode and the second PN diode.

Abstract: In one embodiment, an overvoltage protection device (100) may include a crowbar device (106), where the crowbar device (106) includes a first crowbar terminal (115), the first crowbar terminal (115) connected with a first external voltage line (102). The overvoltage protection device (100) may further include a transient voltage suppression (TVS) device (108), where the TVS device (108) includes a second TVS terminal (121), the second TVS terminal (121) connected with a second external voltage line (104). The crowbar device (106) and the TVS device (108) may be arranged in electrical series between the first crowbar terminal (115) and the second TVS terminal (121).

Abstract: A power switching device may include a semiconductor substrate and a body region comprising an n-type dopant, the body region disposed in an inner portion of the semiconductor substrate; a first base layer disposed adjacent a first surface of the semiconductor substrate, the first p-base layer comprising a p-type dopant; a second base layer disposed adjacent a second surface of the semiconductor substrate, the second base layer comprising a p-type dopant; a first emitter region, disposed adjacent the first surface of the semiconductor substrate, the first emitter region comprising a n-type dopant; a second emitter-region, disposed adjacent the second surface of the semiconductor substrate, the second emitter-region comprising a n-type dopant; a first field stop layer arranged between the first base layer and the body region, the first field stop layer comprising a n-type dopant; and a second field stop layer arranged between the second base layer and the body region, the second field stop layer comprising a n

Abstract: In one embodiment, an overvoltage protection device (100) may include a crowbar device (106), where the crowbar device (106) includes a first crowbar terminal (115), the first crowbar terminal (115) connected with a first external voltage line (102). The overvoltage protection device (100) may further include a transient voltage suppression (TVS) device (108), where the TVS device (108) includes a second TVS terminal (121), the second TVS terminal (121) connected with a second external voltage line (104). The crowbar device (106) and the TVS device (108) may be arranged in electrical series between the first crowbar terminal (115) and the second TVS terminal (121).

Abstract: Provided are a coated cobalt powder and a preparation method thereof, the coated cobalt powder consisting of cobalt powder, and paraffin wax, polyethylene glycol or polyethylene coated on the outer surface of the cobalt powder. Using the coated cobalt powder to replace traditional cobalt powder as the raw material for preparing hard alloys, the dusts generated during production can be reduced, and the environment in a production shop can be improved; simultaneously, the paraffin wax, the polyethylene glycol or the polyethylene coated on the surface of the cobalt powder can effectively prevent the cobalt powder from being oxidized by the oxygen or water vapor in the air, thus improving the quality of the cobalt powder. The preparation process of the coated cobalt powder is free from contamination and the coated cobalt powder is suitable for industrialized production.