Publication number: 20260090433
Abstract: 3D printing material in direct contact with edge of a glass core in IC packages to additively form a frame. Multiple such cores may be reconstituted into a panel that may then be built-up with routing metallization and assembled with IC die. Layers of printed material may be built up to form a frame with approximately the same thickness as the glass core and of any desired lateral width. The printed material may be an organic polymer or inorganic composition including metallics and ceramics. Beads of different material composition may be printed in succession to vary mechanical, electrical and/or thermal properties. A portion of the protective frame may be retained on an edge of the glass core when panels are singulated into package substrate units. Frame material may also be printed upon edges of glass-cored package units after their singulation.
Type:
Application
Filed:
September 26, 2024
Publication date:
March 26, 2026
Applicant:
Intel Corporation
Inventors:
Zhixin Xie, Mohamed Saber, Bohan Shan, Anastasia Arrington, Clay Arrington, Jigneshkumar Patel, Catherine Mau, Ryan Carrazzone, Haobo Chen, Wei Li, Kyle Arrington, Ziyin Lin, Dingying Xu, Hongxia Feng, Hiroki Tanaka, Brandon Marin, Jeremy Ecton, Benjamin Duong, Gang Duan, Srinivas Pietambaram, Praveen Sreeramagiri, Andrew Jimenez, Yekan Wang, Jung Kyu Han