Patents by Inventor Jih-Cheng Yeh

Jih-Cheng Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10894280
    Abstract: A straightening device including: a plurality of rolling members, defining a first channel which is configured for a tubular member to pass therethrough, an extending direction of the first channel being transverse to at least one extending direction of at least one pivot of at least one of the rolling members; at least three shells, each of the at least three shells including two arm portions which are transversely connected with each other, the plurality of rolling members being rotatably disposed between the arm portions, at least one side of at least one of the arm portions having a protruding wall, the protruding wall extending along the at least one extending direction of the at least one pivot and being at least partially overlapped with at least one of the plurality of rolling members as viewed in a radial direction of the at least one pivot.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: January 19, 2021
    Inventors: Jih-Cheng Yeh, Chun-Hsien Wu, Gang Chen
  • Publication number: 20200101508
    Abstract: A straightening device including: a plurality of rolling members, defining a first channel which is configured for a tubular member to pass therethrough, an extending direction of the first channel being transverse to at least one extending direction of at least one pivot of at least one of the rolling members; at least three shells, each of the at least three shells including two arm portions which are transversely connected with each other, the plurality of rolling members being rotatably disposed between the arm portions, at least one side of at least one of the arm portions having a protruding wall, the protruding wall extending along the at least one extending direction of the at least one pivot and being at least partially overlapped with at least one of the plurality of rolling members as viewed in a radial direction of the at least one pivot.
    Type: Application
    Filed: October 1, 2018
    Publication date: April 2, 2020
    Inventors: Jih-Cheng YEH, Chun-Hsien WU, Gang CHEN
  • Publication number: 20200078907
    Abstract: A dismantling tool comprises a main body, a pushing mechanism, and an insertion hole. The pushing mechanism includes a driving portion and a pushing portion. The driving portion is located at the main body. The pushing element is movably screwed with the driving portion. The insertion hole is formed on the main body for a handtool to insert therein for engagement.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 12, 2020
    Inventor: Jih-Cheng YEH
  • Publication number: 20060128146
    Abstract: A method of fabricating a barrier layer is described. A material layer having an opening formed therein is provided. Then, the material layer is disposed inside a physical vapor deposition chamber and a first deposition process is performed to form a first barrier layer on the surface of the opening. The first deposition process includes turning on a plasma source and turning off the plasma source. The turning on of the plasma source and the turning off of the plasma source are separated from each other by an interval less than 2 seconds. Thereafter, the first deposition process is repeated several times to form a second barrier layer comprising a plurality of first barrier layers.
    Type: Application
    Filed: October 19, 2005
    Publication date: June 15, 2006
    Inventors: Chia-Lin Hsu, Shu-Jen Chen, Jih-Cheng Yeh, Chih-Chiang Wu
  • Patent number: 6894364
    Abstract: A fabrication method for an integrated device having a capacitor in an interconnect system is described. At least a first exposed metal line and a second metal line are provided in an insulating layer. A stack layer is deposited and patterned to form a film stack structure over the second metal line. An inter-metal dielectric layer is formed over the film stack structure, the first metal line and the insulating layer. At least a first dual damascene interconnect and a second dual damascene interconnect are formed over and in contact with the first metal line and the film stack structure, respectively.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: May 17, 2005
    Assignee: United Microelectronics Corp.
    Inventors: Ming-Yin Hao, Tri-Rung Yew, Coming Chen, Tsong-Minn Hsieh, Nai-Chen Peng, Jih-Cheng Yeh
  • Publication number: 20040157392
    Abstract: A fabrication method for an integrated device having a capacitor in an interconnect system is described. At least a first exposed metal line and a second metal line are provided in an insulating layer. A stack layer is deposited and patterned to form a film stack structure over the second metal line. An inter-metal dielectric layer is formed over the film stack structure, the first metal line and the insulating layer. At least a first dual damascene interconnect and a second dual damascene interconnect are formed over and in contact with the first metal line and the film stack structure, respectively.
    Type: Application
    Filed: February 24, 2003
    Publication date: August 12, 2004
    Inventors: MING-YIN HAO, TRI-RUNG YEW, COMING CHEN, TSONG-MINN HSIEH, NAI-CHEN PENG, JIH-CHENG YEH
  • Patent number: D943381
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: February 15, 2022
    Inventor: Jih-Cheng Yeh