Patents by Inventor Jih-Hsu Yeh
Jih-Hsu Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10332669Abstract: An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.Type: GrantFiled: February 13, 2015Date of Patent: June 25, 2019Assignee: CYNTEC CO., LTD.Inventors: Wei-Chien Chang, Chia-Chi Wu, Lang-Yi Chiang, Tsung-Chan Wu, Jih-Hsu Yeh
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Patent number: 10256118Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.Type: GrantFiled: May 7, 2018Date of Patent: April 9, 2019Assignee: CYNTEC CO., LTD.Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
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Patent number: 10121583Abstract: An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.Type: GrantFiled: April 28, 2015Date of Patent: November 6, 2018Assignee: CYNTEC CO., LTDInventors: Wei-Chien Chang, Chia-Chi Wu, Lang-Yi Chiang, Tsung-Chan Wu, Jih-Hsu Yeh
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Publication number: 20180269073Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.Type: ApplicationFiled: May 7, 2018Publication date: September 20, 2018Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
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Patent number: 9991136Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.Type: GrantFiled: May 10, 2017Date of Patent: June 5, 2018Assignee: CYNTEC CO., LTD.Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
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Publication number: 20170323799Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.Type: ApplicationFiled: May 10, 2017Publication date: November 9, 2017Inventors: CHIA PEI CHOU, LANG-YI CHIANG, JIH-HSU YEH, You Chang Tseng
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Patent number: 9691633Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.Type: GrantFiled: July 22, 2014Date of Patent: June 27, 2017Assignee: CYNTEC CO., LTD.Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
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Publication number: 20150243430Abstract: An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.Type: ApplicationFiled: April 28, 2015Publication date: August 27, 2015Inventors: WEI-CHIEN CHANG, CHIA-CHI WU, LANG-YI CHIANG, TSUNG-CHAN WU, JIH-HSU YEH
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Publication number: 20150155091Abstract: An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.Type: ApplicationFiled: February 13, 2015Publication date: June 4, 2015Inventors: WEI-CHIEN CHANG, CHIA-CHI WU, LANG-YI CHIANG, TSUNG-CHAN WU, JIH-HSU YEH
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Patent number: 9009951Abstract: An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.Type: GrantFiled: April 23, 2013Date of Patent: April 21, 2015Assignee: Cyntec Co., Ltd.Inventors: Wei-Chien Chang, Chia-Chi Wu, Lang-Yi Chiang, Tsung-Chan Wu, Jih-Hsu Yeh
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Publication number: 20150027770Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.Type: ApplicationFiled: July 22, 2014Publication date: January 29, 2015Inventors: CHIA PEI CHOU, LANG-YI CHIANG, JIH-HSU YEH, You Chang Tseng
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Publication number: 20130300529Abstract: An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.Type: ApplicationFiled: April 23, 2013Publication date: November 14, 2013Inventors: Wei-Chien Chang, Chia-Chi Wu, Lang-Yi Chiang, Tsung-Chan Wu, Jih-Hsu Yeh