Patents by Inventor Jih-Jian You

Jih-Jian You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heating-cooling module
    Patent number: 10504812
    Abstract: A heating-cooling module is disposed on an electronic component and includes a heat-dissipation element, a first thermal conductive layer, a heater, and a second thermal conductive layer. The heat-dissipation element is arranged over the electronic component. The first thermal conductive layer is arranged between the electronic component and the heat-dissipation element. The heater is arranged over the electronic component, in which the heater and the heat-dissipation element are located above the same side of the electronic component, and the heater and the heat-dissipation element are separated from each other. The second thermal conductive layer is arranged between the electronic component and the heater and is separated from the first thermal conductive layer.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: December 10, 2019
    Assignee: Chicony Electronics Co., Ltd.
    Inventor: Jih-Jian You