Patents by Inventor Jihong Kye

Jihong Kye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two-component epoxy adhesive formulation for high elongation with low modulus
    Patent number: 7157143
    Abstract: Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one flexibilizer present in the range of about 12 to about 16 weight percent, based on the total weight of the epoxy resin component, and an epoxy curative component, including at least one curing agent and at least one flexibilizer present in the range of about 55 to about 65 weight percent, based on the total weight of the epoxy curative component.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: January 2, 2007
    Assignee: Dow Global Technologies Inc.
    Inventor: Jihong Kye
  • Use of aramid fiber conjunction with thermoplastic to improve wash-off resistance and physical properties such as impact and expansion
    Publication number: 20060189722
    Abstract: One-part epoxy adhesive formulations, and methods of using the same, are described. The formulations include, among other things, powdered methacrylate butadiene styrene and aramid pulp to, among other things, improve the wash off resistance, T peel strength, and impact strength characteristics thereof. Additionally, the formulations exhibit desirable expansion characteristics. The formulations are especially suitable for use in joining automotive components.
    Type: Application
    Filed: January 27, 2006
    Publication date: August 24, 2006
    Applicant: Dow Global Technologies Inc.
    Inventor: Jihong Kye
  • Two-component epoxy adhesive formulation for high elongation with low modulus
    Publication number: 20040197563
    Abstract: Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one flexibilizer present in the range of about 12 to about 16 weight percent, based on the total weight of the epoxy resin component, and an epoxy curative component, including at least one curing agent and at least one flexibilizer present in the range of about 55 to about 65 weight percent, based on the total weight of the epoxy curative component.
    Type: Application
    Filed: March 24, 2003
    Publication date: October 7, 2004
    Inventor: Jihong Kye
  • Reactive hot melt adhesive formulation for joining stamped metal and plastic parts
    Publication number: 20040191523
    Abstract: Reactive one-part hot melt epoxy adhesive formulations, and methods of using the same, are described. The formulations include at least one epoxy resin, at least one tackifier, and at least one latent curing agent, and exhibit relatively good thermal stability, high lap shear strength, high T-peel strength, and adhere to a wide range of substrates. The formulations are especially suitable for use in joining automotive components that are subjected to paint oven or electrodeposition oven treatment.
    Type: Application
    Filed: March 24, 2003
    Publication date: September 30, 2004
    Inventor: Jihong Kye