Patents by Inventor Jihong Zhao

Jihong Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11986575
    Abstract: A preparation method of drug-loaded micelles of an absorbable vascular stent coating for angiostenosis in an infant is provided, including the following steps: S1: dissolving a drug to be encapsulated in an appropriate amount of an emulsifying agent, adding a chitosan-poly(p-dioxohone) amphiphilic block copolymer (chitosan-b-PPDO copolymer), and thoroughly mixing to obtain a drug-copolymer solution; S2: adding the drug-copolymer solution obtained in S1 dropwise to an emulsifying agent aqueous solution prepared in advance, and continuously stirring to obtain a stable drug-loaded micellar solution; and S3: removing the emulsifying agent from the micellar solution obtained in S2 through vacuum evaporation, stirring a resulting concentrate, and centrifuging the concentrate to obtain a supernatant; and filtering the supernatant to obtain a filtrate, and subjecting the filtrate to dialysis to obtain the drug-loaded micelles.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: May 21, 2024
    Assignee: XINHUA HOSPITAL AFFILIATED TO SHANGHAI JIAOTONG UNIVERSITY SCHOOL OF MEDICINE
    Inventors: Kun Sun, Jing Sun, Sun Chen, Kai Bai, Yanan Lu, Lu Wang, Fujun Wang, Fan Zhao, Jihong Huang
  • Publication number: 20240079352
    Abstract: Aspects disclosed herein include integrated circuit (IC) packages employing a capacitor interposer substrate with aligned external interconnects, and related fabrication methods. The IC package includes one or more semiconductor dies (“dies”) electrically coupled to a package substrate that supports electrical signal routing to and from the die(s). The capacitor interposer substrate is disposed between the die(s) and the package substrate. The die(s) is coupled to embedded capacitor(s) in the capacitor interposer substrate through die interconnects coupled to external interconnects of the capacitor interposer substrate. In exemplary aspects, the external interconnects on the outer surfaces of the capacitor interposer substrate are aligned.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 7, 2024
    Inventors: Jihong Choi, Giridhar Nallapati, Lily Zhao, Dongming He
  • Publication number: 20110090904
    Abstract: The present invention proposes a method for implementing a customized video service in IMS networks and a network element for controlling sessions between terminals, wherein a first terminal is calling a second terminal under the control of a first network element, and the second terminal has subscribed a customized video service provided by a second network element.
    Type: Application
    Filed: July 1, 2008
    Publication date: April 21, 2011
    Inventors: Jihong Zhao, Yi Sun, Hul Liao, Yutang Luo, Haibin Xu