Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: A display device includes: a display stack structure, an optical adhesive member disposed on the display stack structure, and a cover window disposed on a the optical adhesive member. The cover window includes a front surface, a first side surface extended from the front surface in a first direction and bent, a second side surface extended from the front surface in a second direction and bent, and a corner located between the first side surface and the second side surface. The cover window includes an inner surface adjacent to the display stack structure and an outer surface opposed to the inner surface, and the outer surface of the cover window has a first radius of curvature, and the inner surface of the cover window has a second radius of curvature greater than the first radius of curvature at the corner.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: A multiple sensor-based abnormal condition monitoring method includes determining an operation mode based on condition information in a target area in which an abnormal condition is monitored, receiving sensing signals from a plurality of sensors installed in the target area in response to a first mode in which different objects are simultaneously detected being determined as the operation mode, processing the sensing signals and outputting first sensing data obtained by converting the sensing signals into digital signals, generating first input data to be input to a first neural network model by variably adjusting a size of the first sensing data, performing an operation in an analog domain on the first input data using the first neural network mode and outputting first operation data obtained by converting an operation result into digital data, and outputting a first monitoring result obtained by classifying an abnormal condition based on the first operation data.

Abstract: A method of monitoring an abnormal condition based on multiple sensors includes processing sensing signals received from a plurality of sensors configured to detect different objects and outputting sensing data obtained by converting the sensing signals into digital signals, generating input data to be input to a neural network model by variably adjusting a size of the sensing data, performing an operation in an analog domain on the input data using the neural network mode and outputting operation data obtained by converting an operation result into digital data, and outputting a monitoring result obtained by classifying an abnormal condition based on the operation data.

Abstract: Provided is a power management device including a first power domain operating in a sleep mode consuming minimal power, and a second power domain turned on exclusively when a wake signal is received from an external device within a communication range of the first power domain, wherein the first power domain includes an always-on Digital Low-DropOut (DLDO), and the second power domain includes a main Low-DropOut (LDO), and split sequence control is performed on power management in the first power domain and the second power domain.

Abstract: A technology related to a transmission device of an amplitude modulation method is disclosed. In the amplitude modulation transmission device, a transmission data signal transformed into a sinusoidal wave transition form is input to a signal input stage of a cascode power amplifier, and a transmission data signal transformed into another sinusoidal wave transition form is input to a bias power stage of the cascode power amplifier. The transmission data signal transformed into the sinusoidal wave transition form has a sinusoidal wave form in a section in which input data transitions and maintain its previous value in a section in which the input data is maintained.

Abstract: A display panel includes pixels, each including a light emitting element and a pixel circuit connected to the light emitting element, data lines arranged in a plurality of columns, where the data lines supply data signals to the pixel circuit, data pads connected to the data lines, a first protection circuit connected between a first data line among the data lines and a first gate power line to which a first gate power voltage is applied, and a second protection circuit connected between a second data line among the data lines and a second gate power line to which a second gate power voltage is applied.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: A display device includes first and second pixels disposed adjacent to each other. Each of the first and second pixels includes a light-emitting element, a first transistor controlling a driving current flowing in the light-emitting element, a second transistor supplying a data voltage to a first electrode of the first transistor, a third transistor electrically connecting a second electrode of the first transistor and a gate electrode of the first transistor, and a fourth transistor discharging the gate electrode of the first transistor with a first initialization voltage. The first and second pixels share a fourth-first transistor including a first electrode connected to the fourth transistor of the first pixel and the fourth transistor of the second pixel, and a second electrode connected to a first initialization voltage line supplying the first initialization voltage.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: Provided is a device-to-device (D2D)-based wireless power receiving device including an observation part configured to monitor a battery, an estimator configured to estimate usage and a workload of the battery on the basis of a result of monitoring the battery, a mode determiner configured to determine required power of the battery on the basis of the usage and the workload, and determine a reception mode according to the required power, and a power receiver configured to wirelessly receive power from another device according to the reception mode. Accordingly, wireless power charging efficiency can be maximized.

Abstract: A fluid spray device for processing a substrate according to the present invention includes a spray nozzle configured to spray a processing fluid toward a substrate supported on a table, and a scattering prevention cover configured to block contaminants from being scattered by the sprayed processing fluid hitting the substrate.

Abstract: System and method for detecting and classifying direct response advertisements.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.