Abstract: An optical device may include an optical fiber, a solder material, and a fibermount comprising a non-porous material. The optical fiber may be affixed to the fibermount by the solder material. The non-porous material of the fibermount may have a thermal conductivity of less than 20 Watts per meter-Kelvin (W/m-K). A coefficient of thermal expansion (CTE) of the non-porous material of the fibermount may match a CTE of the solder material. The CTE of the non-porous material of the fibermount may match a CTE of a material of the optical fiber.

Abstract: A laser module includes a laser submodule, a polarization beam combiner (PBC), a beam rotator, a grating, and an output fiber (e.g., each disposed on an internal surface of a floor of the laser module). The laser submodule is configured to emit an array pattern of beams, which the PBC is configured to combine into a vertical stack pattern of beams, which the beam rotator is configured to rotate into a horizontal stack pattern of beams, which the grating is configured to combine into an overlapped pattern of beams, which the output fiber is configured to emit. The vertical stack pattern of beams, the horizontal stack pattern of beams, and the overlapped pattern of beams are to transmit through the laser module parallel to a single common plane (e.g., that is parallel to the internal surface of the floor of the laser module).

Abstract: A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material is position between a chip and a submount. The method may further include irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles. The polymer may form a layer on the sintered silver particles.

Abstract: In some implementations, an emitter module may include an emitter array that includes multiple emitters, and an optical fiber that includes multiple cores within a single cladding. The emitter array may be optically coupled to a tip of the optical fiber such that each emitter, of the multiple emitters of the emitter array, is optically coupled to a respective core of the multiple cores of the optical fiber. The optical fiber may include an integral lens at the tip of the optical fiber. The integral lens at the tip of the optical fiber may be in alignment with the multiple cores of the optical fiber.

Abstract: A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material is position between a chip and a submount. The method may further include irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles. The polymer may form a layer on the sintered silver particles.

Abstract: In some implementations, an emitter module may include an emitter array that includes multiple emitters, and an optical fiber that includes multiple cores within a single cladding. The emitter array may be optically coupled to a tip of the optical fiber such that each emitter, of the multiple emitters of the emitter array, is optically coupled to a respective core of the multiple cores of the optical fiber. The optical fiber may include an integral lens at the tip of the optical fiber. The integral lens at the tip of the optical fiber may be in alignment with the multiple cores of the optical fiber.

Abstract: A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material is position between a chip and a submount. The method may further include irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles. The polymer may form a layer on the sintered silver particles.

Abstract: An optical system may include an emitter array to emit a plurality of beams of light, and a lens array. The lens array may be arranged to collimate and direct each of the plurality of beams of light. A pitch between lenses of the lens array may be larger than a pitch between emitters of the emitter array in order to cause the plurality of beams of light to be directed such that they diverge after exiting the lens array. The optical system may include a diffractive optical element to distribute each of the plurality of beams of light into a plurality of beamlets in association with creating a light pattern. The divergence of each of the plurality of beams of light may cause a plurality of zero-order beamlets, each corresponding to one of the plurality of beams of light, to diverge after exiting the diffractive optical element.

Abstract: A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

Abstract: A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

Abstract: A gain-module for a laser resonator has an elongated gain-element located in an diffusely reflective cylindrical enclosure having an elongated entrance slit for admitting pump radiation. Pump radiation is supplied by two diode-laser arrays assemblies each including a fast-axis collimating lens. Propagation axes of the diode-laser array assemblies are at an angle to each other. The propagation axes extend through the entrance slit into the enclosure without being intercepted by the gain-element and with the gain-element being located between the propagation-axes.