Patents by Inventor Ji-Hye YEON
Ji-Hye YEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11764336Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: GrantFiled: July 26, 2021Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
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Publication number: 20210351330Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: July 26, 2021Publication date: November 11, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong II KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Patent number: 11075326Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: GrantFiled: June 26, 2020Date of Patent: July 27, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
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Patent number: 10991857Abstract: A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.Type: GrantFiled: June 17, 2019Date of Patent: April 27, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wan Tae Lim, Sung Hyun Sim, Hanul Yoo, Yong Il Kim, Hye Seok Noh, Ji Hye Yeon
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Patent number: 10957833Abstract: A light emitting diode display device includes a display board comprising a plurality of unit pixels, a drive circuit board including a plurality of drive circuit regions corresponding to the plurality of unit pixels, and a plurality of bumps interposed between the plurality of unit pixels and the plurality of drive circuit regions. The plurality of unit pixels comprises a first unit pixel including a first P electrode. The plurality of drive circuit regions comprises a first drive circuit region corresponding to the first unit pixel and a first pad connected to a first drive transistor, the plurality of bumps includes a first solder in contact with the first pad, and a first bump on the first solder and including a first filler in contact with the first P electrode, the first solder includes at least one of tin and silver, and the first filler includes copper or nickel.Type: GrantFiled: March 18, 2019Date of Patent: March 23, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Tan Sakong, Yong Il Kim, Han Kyu Seong, Ji Hye Yeon, Chung Sun Lee, Ji Hwan Hwang
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Patent number: 10892298Abstract: A light emitting diode display device is provided.Type: GrantFiled: November 30, 2018Date of Patent: January 12, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Tan Sakong, Yong Il Kim, Jong Uk Seo, Ji Hye Yeon
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Publication number: 20200328329Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: June 26, 2020Publication date: October 15, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong II KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Patent number: 10797040Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.Type: GrantFiled: February 21, 2020Date of Patent: October 6, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye Yeon, Su Hyun Jo, Sung Hyun Sim, Ha Nul Yoo, Yong Il Kim, Han Kyu Seong
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Patent number: 10770436Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.Type: GrantFiled: October 24, 2019Date of Patent: September 8, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Ji-hye Yeon, Wan-tae Lim, Young-soo Park, Jung-sub Kim, Jin-sub Lee, Ha-nul Yoo, Hye-seok Noh
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Patent number: 10707393Abstract: A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.Type: GrantFiled: June 1, 2018Date of Patent: July 7, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Dong Gun Lee, Yong Il Kim, Han Kyu Seong, Ji Hye Yeon, Jin Sub Lee, Young Jin Choi
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Patent number: 10700246Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: GrantFiled: March 12, 2019Date of Patent: June 30, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
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Publication number: 20200194417Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.Type: ApplicationFiled: February 21, 2020Publication date: June 18, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Ji Hye Yeon, Su Hyun Jo, Sung Hyun Sim, Ha Nul Yoo, Yong Il Kim, Han Kyu Seong
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Patent number: 10686103Abstract: A light emitting apparatus includes at least one first light source and at least one second light source. The at least one first light source and at least one second light source may be configured to emit white light and cyan light, respectively, such that a ratio of luminous flux of the white light to luminous flux of the cyan light ranges from 19:1 to 370:1, based on a common magnitude of electrical current being applied to each of the at least one first light source and the at least one second light source.Type: GrantFiled: May 21, 2018Date of Patent: June 16, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Ji Hye Yeon, Han Kyu Seong, Yong Il Kim, Jung Sub Kim
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Publication number: 20200105980Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: March 12, 2019Publication date: April 2, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong Il KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Publication number: 20200066689Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.Type: ApplicationFiled: October 24, 2019Publication date: February 27, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Ji-hye YEON, Wan-tae LIM, Young-soo PARK, Jung-sub KIM, Jin-sub LEE, Ha-nul YOO, Hye-seok NOH
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Patent number: 10573632Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.Type: GrantFiled: November 9, 2018Date of Patent: February 25, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye Yeon, Su Hyun Jo, Sung Hyun Sim, Ha Nul Yoo, Yong Il Kim, Han Kyu Seong
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Patent number: 10566382Abstract: A semiconductor light emitting device includes a plurality of light emitting cells including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first and second conductivity type semiconductor layers, an insulating layer on the plurality of light emitting cells and having a first opening and a second opening defining a first contact region of the first conductivity type semiconductor layer and a second contact region of the second conductivity type semiconductor layer, respectively, in each of the plurality of light emitting cells, a connection electrode on the insulating layer and connecting the first contact region and the second contact region to electrically connect the plurality of light emitting cells to each other, a transparent support substrate on the insulating layer and the connection electrode, and a transparent bonding layer between the insulating layer and the transparent support substrate.Type: GrantFiled: October 20, 2017Date of Patent: February 18, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye Yeon, Han Kyu Seong, Wan Tae Lim, Sung Hyun Sim, Hanul Yoo
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Patent number: 10553641Abstract: A light emitting device package includes a substrate for growth having a plurality of light-emitting windows, a plurality of semiconductor light-emitting units corresponding to the plurality of light-emitting windows, each semiconductor light-emitting unit having a first surface contacting the substrate for growth and a second surface opposite the first surface, and each semiconductor light-emitting unit having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on each other, a plurality of wavelength conversion units respectively disposed inside the plurality of light-emitting windows, each wavelength conversion unit is configured to provide light having a wavelength different from light emitted by the respective semiconductor light-emitting unit, a metal support layer disposed on at least one surface of each of the plurality of semiconductor light-emitting units and having a lateral surface coplanar with a lateral surface of the substraType: GrantFiled: March 23, 2018Date of Patent: February 4, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye Yeon, Sung Hyun Sim, Wan Tae Lim, Yong Il Kim, Hanul Yoo
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Publication number: 20190371779Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.Type: ApplicationFiled: November 9, 2018Publication date: December 5, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye YEON, Su Hyun JO, Sung Hyun SIM, Ha Nul YOO, Yong Il KIM, Han Kyu SEONG
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Patent number: 10497683Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.Type: GrantFiled: November 1, 2018Date of Patent: December 3, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Ji-hye Yeon, Wan-tae Lim, Young-soo Park, Jung-sub Kim, Jin-sub Lee, Ha-nul Yoo, Hye-seok Noh