Patents by Inventor Ji-Hyuk Park

Ji-Hyuk Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR REMOVING LIDAR POINT CLOUD NOISE
    Publication number: 20220214427
    Abstract: Disclosed is a method and apparatus for removing LiDAR point cloud noise. This method removes in real time only the LiDAR point cloud noise acquired in snowfall and rain environments, leaving behind the environmental characteristics of the LiDAR point cloud. Accordingly, it is possible to maximize the utilization of the LiDAR.
    Type: Application
    Filed: September 28, 2021
    Publication date: July 7, 2022
    Inventors: Kyung Soo KIM, Ji-II PARK, Min Seong CHOI, Hyun Yong JEON, Ji Hyuk PARK
  • POLYAMIDE RESIN COMPOSITION FOR WHEEL COVER
    Publication number: 20140228492
    Abstract: Disclosed is a polyamide resin composition for a wheel cover, which has an excellent balance between rigidity and toughness, improved low temperature impact property, excellent heat resistance, and improved strength of the surface of the composition and the weld. In particular, the polyamide resin composition comprises a polyamide 6 resin, an ethylene-based copolymer, a styrene-based copolymer, a maleic anhydride grafted styrene, an imide-based copolymer, nano-minerals, and a phenolic heat-resistant material.
    Type: Application
    Filed: July 8, 2013
    Publication date: August 14, 2014
    Inventors: Duck-Hyoung Hwang, Yong-Chul Lee, Sung-Woo Lee, Chang-Gyu Kim, Ji-Hyuk Park