Patents by Inventor Jiin HWANG

Jiin HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing copper alloy sheet material with excellent strength and conductivity and copper alloy sheet material produced therefrom
    Patent number: 11535920
    Abstract: Disclosed is a method of producing a copper alloy sheet material, wherein the copper alloy sheet material contains nickel (Ni) 0.5 to 1.5% by weight; cobalt (Co) 0.3 to 1.5% by weight; silicon (Si) 0.35 to 0.8% by weight; chromium (Cr) 0.05 to 0.5% by weight; a balance amount of copper (Cu); and inevitable impurities. Further, disclosed is a copper alloy sheet material produced using the method.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: December 27, 2022
    Assignee: POONGSAN CORPORATION
    Inventors: Jiin Hwang, Youngchul Choi, Jeongmin Cha, Jangho Ju
  • METHOD OF PRODUCING COPPER ALLOY SHEET MATERIAL WITH EXCELLENT STRENGTH AND CONDUCTIVITY AND COPPER ALLOY SHEET MATERIAL PRODUCED THEREFROM
    Publication number: 20220136089
    Abstract: Disclosed is a method of producing a copper alloy sheet material, wherein the copper alloy sheet material contains nickel (Ni) 0.5 to 1.5% by weight; cobalt (Co) 0.3 to 1.5% by weight; silicon (Si) 0.35 to 0.8% by weight; chromium (Cr) 0.05 to 0.5% by weight; a balance amount of copper (Cu); and inevitable impurities. Further, disclosed is a copper alloy sheet material produced using the method.
    Type: Application
    Filed: February 25, 2020
    Publication date: May 5, 2022
    Applicant: POONGSAN CORPORATION
    Inventors: Jiin HWANG, Youngchul CHOI, Jeongmin CHA, Jangho JU