Patents by Inventor Jiing H. Wang

Jiing H. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6118646
    Abstract: A capacitor structure including a housing and two copper plates disposed on two sides of an interior of the housing. A capacitor element is installed in the housing. The opposite inner sides of each copper plate are disposed with multiple longitudinally arranged small resilient plates which inward extend to engage with the capacitor element in the housing. An outer side of each copper plate is disposed with an upper and a lower engaging plates which are longitudinally inclinedly arranged. The upper and lower engaging plates serve to engage with or attach to a conductive wire inserted into the housing. The upper and lower engaging plates of the copper plate can at the same time contact with the conductive wire so that it can enhance the electricity conduction effect. The capacitor structure enables a user to replace the capacitor element and copper plates by himself.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: September 12, 2000
    Inventors: Akira Yang, Jiing H. Wang