Patents by Inventor Jijie Zhou

Jijie Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8647922
    Abstract: The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: February 11, 2014
    Assignee: Nanyang Technological University
    Inventors: Jijie Zhou, Zhong Chen
  • Patent number: 8486824
    Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: July 16, 2013
    Assignees: STMicroelectronics Asia Pacific PTE., Ltd., Nanyang Technological University
    Inventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
  • Publication number: 20130012016
    Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 10, 2013
    Applicant: STMicroelectronics Asia Pacific PTE Ltd
    Inventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
  • Patent number: 8217518
    Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: July 10, 2012
    Assignees: STMicroelectronics Asia Pacific Pte., Ltd., Nanyang Technological University
    Inventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
  • Patent number: 8021967
    Abstract: A fluid transport method and fluid transport device are disclosed. Nanoscale fibers disposed in a patterned configuration allow transport of a fluid in absence of an external power source. The device may include two or more fluid transport components having different fluid transport efficiencies. The components may be separated by additional fluid transport components, to control fluid flow.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: September 20, 2011
    Assignee: California Institute of Technology
    Inventors: Jijie Zhou, Michael Bronikowski, Flavio Noca, Elijah B. Sansom
  • Publication number: 20090239338
    Abstract: The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.
    Type: Application
    Filed: November 8, 2007
    Publication date: September 24, 2009
    Inventors: Jijie Zhou, Zhong Chen
  • Patent number: 7491628
    Abstract: A method of assembling large numbers of nanoscale structures in pre-determined ways using fluids or capillary lithography to control the patterning and arrangement of the individual nanoscale objects and nanostructures formed in accordance with the inventive method are provided. In summary, the current method uses the controlled dispersion and evaporation of fluids to form controlled patterns of nanoscale objects or features anchored on a substrate, such as nanoscale fibers like carbon nanotubes.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: February 17, 2009
    Assignee: California Institute of Technology
    Inventors: Flavio Noca, Elijah B. Sansom, Jijie Zhou, Morteza Gharib
  • Publication number: 20070216032
    Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.
    Type: Application
    Filed: March 7, 2007
    Publication date: September 20, 2007
    Applicants: STMicroelectronics Asia Pacific PTE Ltd, Nanyang Technological University
    Inventors: Tong Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Loo
  • Publication number: 20070099311
    Abstract: A fluid transport method and fluid transport device are disclosed. Nanoscale fibers disposed in a patterned configuration allow transport of a fluid in absence of an external power source. The device may include two or more fluid transport components having different fluid transport efficiencies. The components may be separated by additional fluid transport components, to control fluid flow.
    Type: Application
    Filed: October 31, 2005
    Publication date: May 3, 2007
    Inventors: Jijie Zhou, Michael Bronikowski, Flavio Noca, Elijah Sansom
  • Patent number: 7163385
    Abstract: A hydro-elastic pumping system formed from an elastic tube element having attached end members with different hydroimpedance properties, wherein the elastic element is pinched with certain frequency and duty cycle to form asymmetric forces that pump fluid.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: January 16, 2007
    Assignee: California Institute of Technology
    Inventors: Morteza Gharib, Anna Iwaniec, Jijie Zhou, Flavio Noca
  • Publication number: 20060088848
    Abstract: A method of assembling large numbers of nanoscale structures in pre-determined ways using fluids or capillary lithography to control the patterning and arrangement of the individual nanoscale objects and nanostructures formed in accordance with the inventive method are provided. In summary, the current method uses the controlled dispersion and evaporation of fluids to form controlled patterns of nanoscale objects or features anchored on a substrate, such as nanoscale fibers like carbon nanotubes.
    Type: Application
    Filed: May 5, 2005
    Publication date: April 27, 2006
    Inventors: Flavio Noca, Elijah Sansom, Jijie Zhou, Morteza Gharib
  • Publication number: 20040101414
    Abstract: A hydro-elastic pumping system formed from an elastic tube element having attached end members with different hydroimpedance properties, wherein the elastic element is pinched with certain frequency and duty cycle to form asymmetric forces that pump fluid
    Type: Application
    Filed: March 4, 2003
    Publication date: May 27, 2004
    Inventors: Morteza Gharib, Anna Iwaniec, Jijie Zhou, Flavio Noca