Patents by Inventor Jijie Zhou
Jijie Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8647922Abstract: The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.Type: GrantFiled: November 8, 2007Date of Patent: February 11, 2014Assignee: Nanyang Technological UniversityInventors: Jijie Zhou, Zhong Chen
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Patent number: 8486824Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.Type: GrantFiled: July 10, 2012Date of Patent: July 16, 2013Assignees: STMicroelectronics Asia Pacific PTE., Ltd., Nanyang Technological UniversityInventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
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Publication number: 20130012016Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.Type: ApplicationFiled: July 10, 2012Publication date: January 10, 2013Applicant: STMicroelectronics Asia Pacific PTE LtdInventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
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Patent number: 8217518Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.Type: GrantFiled: March 7, 2007Date of Patent: July 10, 2012Assignees: STMicroelectronics Asia Pacific Pte., Ltd., Nanyang Technological UniversityInventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
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Patent number: 8021967Abstract: A fluid transport method and fluid transport device are disclosed. Nanoscale fibers disposed in a patterned configuration allow transport of a fluid in absence of an external power source. The device may include two or more fluid transport components having different fluid transport efficiencies. The components may be separated by additional fluid transport components, to control fluid flow.Type: GrantFiled: October 31, 2005Date of Patent: September 20, 2011Assignee: California Institute of TechnologyInventors: Jijie Zhou, Michael Bronikowski, Flavio Noca, Elijah B. Sansom
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Publication number: 20090239338Abstract: The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.Type: ApplicationFiled: November 8, 2007Publication date: September 24, 2009Inventors: Jijie Zhou, Zhong Chen
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Patent number: 7491628Abstract: A method of assembling large numbers of nanoscale structures in pre-determined ways using fluids or capillary lithography to control the patterning and arrangement of the individual nanoscale objects and nanostructures formed in accordance with the inventive method are provided. In summary, the current method uses the controlled dispersion and evaporation of fluids to form controlled patterns of nanoscale objects or features anchored on a substrate, such as nanoscale fibers like carbon nanotubes.Type: GrantFiled: May 5, 2005Date of Patent: February 17, 2009Assignee: California Institute of TechnologyInventors: Flavio Noca, Elijah B. Sansom, Jijie Zhou, Morteza Gharib
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Publication number: 20070216032Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.Type: ApplicationFiled: March 7, 2007Publication date: September 20, 2007Applicants: STMicroelectronics Asia Pacific PTE Ltd, Nanyang Technological UniversityInventors: Tong Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Loo
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Publication number: 20070099311Abstract: A fluid transport method and fluid transport device are disclosed. Nanoscale fibers disposed in a patterned configuration allow transport of a fluid in absence of an external power source. The device may include two or more fluid transport components having different fluid transport efficiencies. The components may be separated by additional fluid transport components, to control fluid flow.Type: ApplicationFiled: October 31, 2005Publication date: May 3, 2007Inventors: Jijie Zhou, Michael Bronikowski, Flavio Noca, Elijah Sansom
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Patent number: 7163385Abstract: A hydro-elastic pumping system formed from an elastic tube element having attached end members with different hydroimpedance properties, wherein the elastic element is pinched with certain frequency and duty cycle to form asymmetric forces that pump fluid.Type: GrantFiled: March 4, 2003Date of Patent: January 16, 2007Assignee: California Institute of TechnologyInventors: Morteza Gharib, Anna Iwaniec, Jijie Zhou, Flavio Noca
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Publication number: 20060088848Abstract: A method of assembling large numbers of nanoscale structures in pre-determined ways using fluids or capillary lithography to control the patterning and arrangement of the individual nanoscale objects and nanostructures formed in accordance with the inventive method are provided. In summary, the current method uses the controlled dispersion and evaporation of fluids to form controlled patterns of nanoscale objects or features anchored on a substrate, such as nanoscale fibers like carbon nanotubes.Type: ApplicationFiled: May 5, 2005Publication date: April 27, 2006Inventors: Flavio Noca, Elijah Sansom, Jijie Zhou, Morteza Gharib
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Publication number: 20040101414Abstract: A hydro-elastic pumping system formed from an elastic tube element having attached end members with different hydroimpedance properties, wherein the elastic element is pinched with certain frequency and duty cycle to form asymmetric forces that pump fluidType: ApplicationFiled: March 4, 2003Publication date: May 27, 2004Inventors: Morteza Gharib, Anna Iwaniec, Jijie Zhou, Flavio Noca