Patents by Inventor Jijun Xiong
Jijun Xiong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250007218Abstract: The application belongs to the technical field of signal acquisition, and discloses a stacked large-capacity signal acquisition and transmission system, which includes an adapter board, n acquisition boards, central control boards and a communication board sequentially laminated; where a circuit structure of each of the acquisition boards is the same; the adapter board is provided with circuit board interfaces and a plurality of first board-level connectors; an m-th acquisition board is provided with a signal acquisition and conditioning module, at least n-m+1 second board-level connectors and at least m third board-level connectors; the central control board is provided with a signal conversion module, at least one fourth board-level connector and at least one fifth board-level connector.Type: ApplicationFiled: June 26, 2024Publication date: January 2, 2025Inventors: Qiulin TAN, Helei DONG, Junqi PANG, Hua REN, Lei ZHANG, Wenyi LIU, Jijun XIONG
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Patent number: 12184009Abstract: The application belongs to the technical field of signal acquisition, and discloses a stacked large-capacity signal acquisition and transmission system, which includes an adapter board, n acquisition boards, central control boards and a communication board sequentially laminated; where a circuit structure of each of the acquisition boards is the same; the adapter board is provided with circuit board interfaces and a plurality of first board-level connectors; an m-th acquisition board is provided with a signal acquisition and conditioning module, at least n?m+1 second board-level connectors and at least m third board-level connectors; the central control board is provided with a signal conversion module, at least one fourth board-level connector and at least one fifth board-level connector.Type: GrantFiled: June 26, 2024Date of Patent: December 31, 2024Assignee: NORTH UNIVERSITY OF CHINAInventors: Qiulin Tan, Helei Dong, Junqi Pang, Hua Ren, Lei Zhang, Wenyi Liu, Jijun Xiong
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Patent number: 11891917Abstract: A method for measuring surface temperature of a turbine blade includes following steps: step 1: cleaning a turbine blade and blowing dry; step 2: firstly, preparing a NiCrAlY (nickel-chromium-aluminum-yttrium) buffer layer and then preparing an YSZ (yttria-stabilized zirconia) insulating layer; step 3, preparing alumina sol; step 4, preparing an alumina insulating layer; step 5, preparing a strip-shaped platinum electrode layer; step 6, preparing a platinum-filled lead wire; step 7: firstly, connecting a platinum wire to a surface of a tail end of the strip-shaped platinum electrode layer, and then connecting a nickel-chromium alloy wire to a tenon end of the turbine blade; step 8, preparing alumina protective layers; and step 9, connecting two cold junctions of a thermocouple with a data collector.Type: GrantFiled: May 31, 2023Date of Patent: February 6, 2024Assignee: NORTH UNIVERSITY OF CHINAInventors: Helei Dong, Qiulin Tan, Jijun Xiong, Lei Zhang, Yanyan Niu
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Publication number: 20230392509Abstract: A method for measuring surface temperature of a turbine blade includes following steps: step 1: cleaning a turbine blade and blowing dry; step 2: firstly, preparing a NiCrAlY (nickel-chromium-aluminum-yttrium) buffer layer and then preparing an YSZ (yttria-stabilized zirconia) insulating layer; step 3, preparing alumina sol; step 4, preparing an alumina insulating layer; step 5, preparing a strip-shaped platinum electrode layer; step 6, preparing a platinum-filled lead wire; step 7: firstly, connecting a platinum wire to a surface of a tail end of the strip-shaped platinum electrode layer, and then connecting a nickel-chromium alloy wire to a tenon end of the turbine blade; step 8, preparing alumina protective layers; and step 9, connecting two cold junctions of a thermocouple with a data collector.Type: ApplicationFiled: May 31, 2023Publication date: December 7, 2023Inventors: Helei DONG, Qiulin TAN, Jijun XIONG, Lei ZHANG, Yanyan NIU
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Patent number: 11796351Abstract: Some embodiments of the disclosure provide a demodulation system for obtaining phase change parameters by a fiber-optic Fabry Perot sensor. In an embodiment, the demodulation system includes a transmitting module, a fiber-optic Fabry Perot sensor, a light splitting module, a filter module, a receiving module, and a processing module. The transmitting module transmits a beam with a predetermined wavelength range. The fiber-optic Fabry Perot sensor receives the beam and forms a reflected light beam. The light splitting module is arranged between the transmitting module and the fiber-optic Fabry Perot sensor. The filter module obtains the first light beam, the second light beam, and the third light beam. The filter module has a broadband filter. The receiving module receives the first light beam, the second light beam, and the third light beam and converts them into the first signal, the second signal, and the third signal.Type: GrantFiled: August 23, 2022Date of Patent: October 24, 2023Assignee: North University of ChinaInventors: Pinggang Jia, Jijun Xiong, Qianyu Ren, Jia Liu, Guowen An, Wenyi Liu
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Publication number: 20230146607Abstract: Disclosed in the present disclosure are a surface-acoustic-wave temperature and pressure sensing device and a manufacturing method thereof.Type: ApplicationFiled: June 9, 2022Publication date: May 11, 2023Inventors: Qiulin TAN, Xiaorui LIANG, Juan ZHANG, Lei ZHANG, Wendong ZHANG, Jijun XIONG
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Publication number: 20230126060Abstract: The present disclosure discloses a surface acoustic wave temperature sensor and a manufacturing method thereof. The surface acoustic wave temperature sensor includes a sensing module and an antenna module electrically connected to each other. The antenna module includes a first high-temperature-resistant substrate and a patterned antenna formed on a surface of the first high-temperature-resistant substrate, a recess is formed in a first surface of the first high-temperature-resistant substrate, and the sensing module is fixed in the recess. The sensing module and the antenna module of the surface acoustic wave temperature sensor provided by the present disclosure form a whole. Therefore, compared with the prior art, the volume is greatly reduced, and wireless passive temperature monitoring in a high-temperature and narrow space can be better implemented. Moreover, the sensing module can be integrated in the antenna module, and such a structure is more convenient for batch processing.Type: ApplicationFiled: June 16, 2022Publication date: April 27, 2023Inventors: Qiulin TAN, Xiaorui LIANG, Xiangrong LI, Lei ZHANG, Wendong ZHANG, Jijun XIONG
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Publication number: 20230062957Abstract: Some embodiments of the disclosure provide a demodulation system for obtaining phase change parameters by a fiber-optic Fabry Perot sensor. In an embodiment, the demodulation system includes a transmitting module, a fiber-optic Fabry Perot sensor, a light splitting module, a filter module, a receiving module, and a processing module. The transmitting module transmits a beam with a predetermined wavelength range. The fiber-optic Fabry Perot sensor receives the beam and forms a reflected light beam. The light splitting module is arranged between the transmitting module and the fiber-optic Fabry Perot sensor. The filter module obtains the first light beam, the second light beam, and the third light beam. The filter module has a broadband filter. The receiving module receives the first light beam, the second light beam, and the third light beam and converts them into the first signal, the second signal, and the third signal.Type: ApplicationFiled: August 23, 2022Publication date: March 2, 2023Applicant: North University of ChinaInventors: Pinggang Jia, Jijun Xiong, Qianyu Ren, Jia Liu, Guowen An, Wenyi Liu
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Publication number: 20230009271Abstract: Some embodiments of the disclosure provides a method for preparing a sensing unit of a fiber-optic Fabry-Perot pressure sensor. The method includes the following steps. Preparing a first quartz sheet and a second quartz sheet, polishing the upper surface of the first quartz sheet, and polishing the upper surface of the second quartz sheet. Fabricating a plurality of grooves in the upper surface of the first quartz sheet. Fabricating through holes in the lower surface of the first quartz sheet, each of the through holes being coaxial with a corresponding groove and communicating with the corresponding groove. Combining the upper surface of the second quartz sheet with the upper surface of the first quartz sheet to form a laminated body. Cutting the plurality of grooves of the laminated body to obtain a plurality of sensing units.Type: ApplicationFiled: July 7, 2022Publication date: January 12, 2023Applicant: NORTH UNIVERSITY OF CHINAInventors: Pinggang Jia, Jijun Xiong, Jiashun Li, Guocheng Fang, Jia Liu, Guowen An, Ting Liang
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Patent number: 11137301Abstract: Some embodiments of the disclosure provide an optical fiber Fabry-Perot sensor (1), and a manufacturing method thereof. According to an embodiment, the optical fiber Fabry-Perot sensor (1) includes a hollow tube body (10), a first optical fiber (20), and a second optical fiber (30). The hollow tube body (10) has a first tube body (11), a cavity portion (12), and a second tube body (13) sequentially arranged in an axial direction. The first optical fiber (20) is provided within the first tube body (11) in the axial direction and has a first light guide end face (21) provided within the cavity portion (12). The second optical fiber (30) is provided in the second tube body (13) in the axial direction and has a second light guide end face (31) provided within the cavity portion (12).Type: GrantFiled: November 13, 2017Date of Patent: October 5, 2021Assignee: North University of ChinaInventors: Jijun Xiong, Pinggang Jia, Guocheng Fang, Yingping Hong, Ting Liang, Qiulin Tan, Wenyi Liu
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Patent number: 11079296Abstract: A pressure-sensitive chip, a pressure sensor, and a pressure monitoring system. In an embodiment, a pressure-sensitive chip and a signal processing module are packaged to form a pressure sensor. The pressure sensor and a display instrument are connected to form a pressure monitoring system. A pressure-sensitive chip is a ceramic body made of eight green ceramic sheets by stacking and sintering, and includes two capacitors. In another embodiment, a pressure signal of a measurement area is obtained by a method including the following steps: sensing a pressure in a measurement area by the pressure-sensitive chip; generating a capacitance signal by the pressure-sensitive chip; converting the capacitance signal to a voltage signal by the signal processing module; and converting the voltage signal into the pressure signal by the display instrument.Type: GrantFiled: January 24, 2020Date of Patent: August 3, 2021Assignee: NORTH UNIVERSITY OF CHINAInventors: Jijun Xiong, Chen Li, Yingping Hong, Boshan Sun
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Publication number: 20210018390Abstract: A pressure-sensitive chip, a pressure sensor, and a pressure monitoring system. In an embodiment, a pressure-sensitive chip and a signal processing module are packaged to form a pressure sensor. The pressure sensor and a display instrument are connected to form a pressure monitoring system. A pressure-sensitive chip is a ceramic body made of eight green ceramic sheets by stacking and sintering, and includes two capacitors. In another embodiment, a pressure signal of a measurement area is obtained by a method including the following steps: sensing a pressure in a measurement area by the pressure-sensitive chip; generating a capacitance signal by the pressure-sensitive chip; converting the capacitance signal to a voltage signal by the signal processing module; and converting the voltage signal into the pressure signal by the display instrument.Type: ApplicationFiled: January 24, 2020Publication date: January 21, 2021Inventors: JIJUN XIONG, CHEN LI, YINGPING HONG, BOSHAN SUN
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Publication number: 20200200624Abstract: Some embodiments of the disclosure provide an optical fiber Fabry-Perot sensor (1), and a manufacturing method thereof. According to an embodiment, the optical fiber Fabry-Perot sensor (1) includes a hollow tube body (10), a first optical fiber (20), and a second optical fiber (30). The hollow tube body (10) has a first tube body (11), a cavity portion (12), and a second tube body (13) sequentially arranged in an axial direction. The first optical fiber (20) is provided within the first tube body (11) in the axial direction and has a first light guide end face (21) provided within the cavity portion (12). The second optical fiber (30) is provided in the second tube body (13) in the axial direction and has a second light guide end face (31) provided within the cavity portion (12).Type: ApplicationFiled: November 13, 2017Publication date: June 25, 2020Inventors: JIJUN XIONG, PINGGANG JIA, GUOCHENG FANG, YINGPING HONG, TING LIANG, QIULIN TAN, WENYI LIU
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Patent number: 9581686Abstract: The invention discloses a silicon-based monolithic integrated sonar array which includes a cantilevered sensing array structure, a sound-transparent jacket, and a support structure. The cantilevered sensing array structure is fixed on the support structure and in the sound-transparent jacket, wherein the sound-transparent jacket is filled with insulating dielectric oil, and the cantilevered sensing array structure is immersed in the insulating dielectric oil. The sound-transparent jacket is sealed and is treated with water tightness processing. The array can be applied into devices for underwater ultrasonic imaging, ultrasonic ranging, torpedo navigating, etc.Type: GrantFiled: March 11, 2011Date of Patent: February 28, 2017Inventors: Wendong Zhang, Chenyang Xue, Guojun Zhang, Linggang Guan, Jijun Xiong, Xibao Liu, Xiaoyao Wang, Jiao Xu
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Publication number: 20130294204Abstract: The invention discloses a silicon-based monolithic integrated sonar array which includes a cantilevered sensing array structure, a sound-transparent jacket, and a support structure. The cantilevered sensing array structure is fixed on the support structure and in the sound-transparent jacket, wherein the sound-transparent jacket is filled with insulating dielectric oil, and the cantilevered sensing array structure is immersed in the insulating dielectric oil. The sound-transparent jacket is sealed and is treated with water tightness processing. The array can be applied, into devices for underwater ultrasonic imaging, ultrasonic ranging, torpedo navigating, etc.Type: ApplicationFiled: March 11, 2011Publication date: November 7, 2013Applicant: North University of ChinaInventors: Wendong Zhang, Chenyang Xue, Guojun Zhang, Linggang Guan, Jijun Xiong, Xibao Liu, Xiaoyao Wang, Jiao Xu