Patents by Inventor Jill E. Steeper

Jill E. Steeper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive composition
    Patent number: 8455175
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: June 4, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark R. Winkle, Jill E. Steeper, Xiang-Qian Liu, Janet Okada-Coakley, Scott A. Ibbitson
  • PHOTOSENSITIVE COMPOSITION
    Publication number: 20110262861
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Application
    Filed: April 26, 2011
    Publication date: October 27, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Mark R. WINKLE, Jill E. STEEPER, Xiang-Qian LIU, Janet OKADA-COAKLEY, Scott A. IBBITSON
  • Photosensitive composition
    Patent number: 7932016
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: April 26, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark R. Winkle, Jill E. Steeper, Xiang-Qian Liu, Janet Okada-Coakley, Scott A. Ibbitson
  • Plating method
    Patent number: 7344970
    Abstract: Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: March 18, 2008
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert S. Forman, Jill E. Steeper, Eric C. Huenger
  • Plating method
    Publication number: 20040018724
    Abstract: Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.
    Type: Application
    Filed: April 7, 2003
    Publication date: January 29, 2004
    Applicant: Shipley Company, L.L.C
    Inventors: Robert S. Forman, Jill E. Steeper, Eric C. Huenger