Patents by Inventor Jim Benjamin

Jim Benjamin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11065149
    Abstract: Disclosed is a system which employs a cooling or heating pad which is preferably rechargeable with hot or cold temperatures at an intended area of the body. The pad includes a highly temperature-conductive or temperature-retentive material which can be cooled or heated using a portable source of heat or cold material delivered to the pad by a removable delivery conduit. Valves can be included to regulate flow of the cooling or heating material from the source to the pad. The system can also include a dual-chambered canister for containing two different media for heating, cooling or for alternating heating and cooling the pad.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: July 20, 2021
    Inventors: Behrouz Benyaminpour, Jim Benjamin, Ramin Benjamin
  • Patent number: 10952892
    Abstract: Disclosed is a system which employs a cooling or heating pad which is preferably a thin, flexible pad for placement at an intended area of the body. The pad includes a layer of highly conductive material which can be cooled or heated using a portable source of heat or cold material delivered to the conductive material by a delivery conduit. Valves can be included to regulate flow of the cooling or heating material from the source to the pad. The system can also include a dual-chambered canister for containing two different media for heating, cooling or for alternating heating and cooling the pad.
    Type: Grant
    Filed: November 25, 2018
    Date of Patent: March 23, 2021
    Inventors: Behrouz Benyaminpour, Jim Benjamin, Ramin Benjamin
  • Publication number: 20190091063
    Abstract: Disclosed is a system which employs a cooling or heating pad which is preferably a thin, flexible pad for placement at an intended area of the body. The pad includes a layer of highly conductive material which can be cooled or heated using a portable source of heat or cold material delivered to the conductive material by a delivery conduit. Valves can be included to regulate flow of the cooling or heating material from the source to the pad. The system can also include a dual-chambered canister for containing two different media for heating, cooling or for alternating heating and cooling the pad.
    Type: Application
    Filed: November 25, 2018
    Publication date: March 28, 2019
    Inventors: Behrouz Benyaminpour, Jim Benjamin, Ramin Benjamin
  • Patent number: 10172739
    Abstract: Disclosed is a system which employs a cooling or heating pad which is preferably a thin, flexible pad for placement at an intended area of the body. The pad includes a layer of highly conductive material which can be cooled or heated using a portable source of heat or cold material delivered to the conductive material by a delivery conduit. Valves can be included to regulate flow of the cooling or heating material from the source to the pad. The system can also include a dual-chambered canister for containing two different media for heating, cooling or for alternating heating and cooling the pad.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: January 8, 2019
    Inventors: Behrouz Benyaminpour, Jim Benjamin, Ramin Benjamin
  • Publication number: 20170246031
    Abstract: Disclosed is a system which employs a cooling or heating pad which is preferably rechargeable with hot or cold temperatures at an intended area of the body. The pad includes a highly temperature-conductive or temperature-retentive material which can be cooled or heated using a portable source of heat or cold material delivered to the pad by a removable delivery conduit. Valves can be included to regulate flow of the cooling or heating material from the source to the pad. The system can also include a dual-chambered canister for containing two different media for heating, cooling or for alternating heating and cooling the pad.
    Type: Application
    Filed: September 30, 2014
    Publication date: August 31, 2017
    Inventors: Behrouz Benyaminpour, Jim Benjamin, Ramin Benjamin
  • Publication number: 20140303698
    Abstract: Disclosed is a system which employs a cooling or heating pad which is preferably a thin, flexible pad for placement at an intended area of the body. The pad includes a layer of highly conductive material which can be cooled or heated using a portable source of heat or cold material delivered to the conductive material by a delivery conduit. Valves can be included to regulate flow of the cooling or heating material from the source to the pad. The system can also include a dual-chambered canister for containing two different media for heating, cooling or for alternating heating and cooling the pad.
    Type: Application
    Filed: July 12, 2013
    Publication date: October 9, 2014
    Inventors: Behrouz Benyaminpour, Jim Benjamin, Ramin Benjamin
  • Publication number: 20040237497
    Abstract: A method of punching chain links for a power transmission chain from metal sheet material to ensure precise location of the apertures relative to the outer link contour of the link being created comprising the steps of piercing the metal sheet material to form the apertures and the back contour of the link at a first station. Piercing the metal sheet material to form link flanks at a second station. Shaving the apertures, the link flanks, and the back contour sequentially at a third same station as the metal sheet material is held stationary. Blanking the outer link contour to separate the link from the metal sheet material at fourth station.
    Type: Application
    Filed: May 30, 2003
    Publication date: December 2, 2004
    Applicant: BorgWarner Inc.
    Inventors: Dave Anderson, Jim Benjamin, Takaharu Yoshimori
  • Patent number: 5455448
    Abstract: A high frequency, high power transistor is vertically isolated by providing a thermally conductive, electrically insulating substrate, upon which the transistor components (including collector, base, and emitter) are grown, positioned directly on the heat sink and a planar top surface formed on the transistor by the base metal contact, the emitter metal contact, and the collector metal contact. Vertical isolation improves the thermal management capabilities of the transistor. Moreover, such a vertically isolated transistor is well-adapted for lateral isolation, which solves the capacitance problems inherent in conventional devices.
    Type: Grant
    Filed: November 16, 1994
    Date of Patent: October 3, 1995
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventor: Jim Benjamin