Patents by Inventor Jim C. Ni

Jim C. Ni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7872871
    Abstract: A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: January 18, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Jim C. Ni, Charles C. Lee, I-Kang Yu, Ming-Shiang Shen
  • Patent number: 7830666
    Abstract: An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: November 9, 2010
    Assignee: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Jim C. Ni, Paul Hsueh, Charles C. Lee, Ming-Shiang Shen
  • Patent number: 7407393
    Abstract: An embodiment of the present invention includes a super slim compact flash (CF) light Universal Serial Bus (USB) device having a top cover, a top cover slot formed within the top cover and forming a top cover slot cavity, a sliding plug connector positioned within the cavity and flexibly movable therein, a plastic frame disposed below and around the top cover, a retractable slim USB plug connector sub-assembly on top of which and connected thereto is placed the sliding plug connector, the sub-assembly including a retractable slim USB plug connector positioned within the device to be flexibly retracted from or pulled into the device by the sliding plug connector for causing connection to a mating USB plug connector.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: August 5, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim C. Ni, Ming-Shiang Shen
  • Patent number: 7364445
    Abstract: A USB device includes a printed circuit board assembly (PCBA), a metal shell secured to a front of the PCBA, a plastic frame secured to a rear of the PCBA, and a rubber case including a case body covering the plastic frame case such that a plug shell connector extends from the second front end opening. A rubber cap is removably mounted over the plug shell connector to entirely enclose the USB device when not in use. The rubber case is molded to include a cosmetic feature, such as a soccer ball, a sports team logo, or a company logo.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: April 29, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim C. Ni, David Nguyen, Nan Nan
  • Patent number: D639303
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: June 7, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim C. Ni, Nan Nan
  • Patent number: D669904
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: October 30, 2012
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim C. Ni, XuLin Cao
  • Patent number: D671123
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: November 20, 2012
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim C. Ni, XuLin Cao
  • Patent number: D675630
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: February 5, 2013
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim C. Ni, XuLin Cao