Abstract: Portable electronic storage device (PESD) manufacturing methods utilizing lead frames are described. According to one exemplary embodiment, a process of manufacturing core unit of PESD comprises: producing a processed flash memory IC chip with several metal contact pads and at least one passive component located on top layer; pre-fabricating a lead frame having opposing first and second surfaces, a plurality of metal connectors disposed on the first surface and a cavity through both surfaces; attaching the top layer of the processed flash memory IC chip onto the first surface such that the metal connectors are electrically connected to the respective metal contact pads and the cavity provides an non-conductive space for the at least one passive component; and forming a molded enclosure on both surfaces of the lead frame to form a core unit, the mold enclosure is configured such that the connectors are exposed according to one of the PESD standards.

Abstract: In one embodiment of the present invention, a universal serial bus (USB) flash drive rotary device is disclosed to include a plastic frame including a USB flash drive and a USB plug connector and a rotary tube at least partially enclosing said plastic frame for deploying said USB plug connector, the USB flash drive is coupled to the USB plug connector, the rotary tube is turned to retract said USB plug connector, the USB flash drive rotary device is for deploying the USB plug connector to couple the USB flash drive to a USB port.

Abstract: A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

Abstract: A metal-wrapped flash-memory-drive device has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a circuit board that is encapsulated by a plastic case. Components are mounted onto the circuit board. A metal wrap conforms to the general shape of a plastic sub-assembly of the plastic case and a plastic cover that enclose the circuit board. The metal wrap can be bent around the plastic sub-assembly in a forming process, or can be pre-formed into a metal tube that the plastic sub-assembly is inserted into. Alignment holes in the metal wrap can fit over plastic stubs on the plastic sub-assembly, or friction can hold the metal wrap to the plastic sub-assembly. The plastic cover and case can be bonded together by molding, ultrasonically, with adhesive films, or using snaps to form the plastic sub-assembly.

Abstract: A flash-memory-drive card has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a board that is encapsulated by upper and lower plastic cases. Components are mounted onto the board on the side opposite the metal contacts. A thinner portion of the plastic case forms a light window that allows a light-emitting diode on the board to shine through the case. The plastic cases can be bonded together ultrasonically or with adhesive or using snaps and groves. Supporting underside ribs in the lower plastic case opposite the metal contacts allow most of the card to be thinner than the spacing in the standard USB socket. Dividers between the metal contacts are formed between openings in the upper case. The dividers help to fill gaps between the slim USB connector and the standard USB socket.

Abstract: A flash-memory-drive card has a Universal-Serial-Bus (USB) connector. The card has a printed-circuit board (PCB) that fits into a perimeter frame that surrounds the edges of the PCB. Metal or plastic upper and lower covers are snapped onto the frame to encapsulate the PCB. The USB connector can be a Full USB connector plug that extends from the perimeter frame and has a centerline approximately matching the PCB centerline for a balanced design, or can be a slim or reduced-height USB connector plug that has a frame closure bar that fits inside closure fittings on the perimeter frame. The USB connector can also be made from a frame extension that has four frame slots through the frame. The PCB has four PCB fingers that are inserted through the frame slots during assembly so that the PCB fingers fit within depressions in the frame extension to form the USB connector plug.