Abstract: A pressure sensor includes a substrate, a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on a first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element, thus multiple pressure sensing elements being disposed on a single substrate can reduce material cost and improve the performance of the pressure sensor.

Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.

Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element. The pressure sensor further includes a buffer layer disposed on the first surface of the substrate such that the first pressure sensing element is disposed on the buffer layer. Multiple pressure sensing elements disposed on a single substrate for improving the performance of the pressure sensor.

Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.

Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

Abstract: Systems and methods for sensing pressure, and protecting a sensor within a sensor assembly. A sensor assembly may comprise a sensor having at least one pressure input port; a first housing configured to encapsulate the sensor; a second housing configured to attach to the first housing to encapsulate the sensor; a first O-ring located between the first housing and the sensor; a second O-ring located between the second housing and the sensor; and a printed circuit board configured to receive detected pressure information from the sensor.

Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

Abstract: Systems and methods for sensing pressure, and protecting a sensor within a sensor assembly. A sensor assembly may comprise a sensor having at least one pressure input port; a first housing configured to encapsulate the sensor; a second housing configured to attach to the first housing to encapsulate the sensor; a first O-ring located between the first housing and the sensor; a second O-ring located between the second housing and the sensor; and a printed circuit board configured to receive detected pressure information from the sensor.

Abstract: Methods of operating a memory device, and memory devices and systems so configured, include receiving a first address range for programming user data to a first range of physical memory addresses of a memory device, receiving a second address range for programming associated metadata to a second range of physical memory addresses of the memory device, determining whether the first address range is contiguous with the second address range, maintaining the second range of physical memory addresses for programming the metadata when it is determined that the second address range is contiguous with the first address range, and, when it is determined that the second address range is not contiguous with the first address range, remapping the second address range to a third range of physical memory addresses of the memory contiguous with the first range of physical memory addresses for programming the metadata.

Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.

Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.

Abstract: Methods for remapping and/or compacting data in memory devices, memory devices, and systems are disclosed. One such method of remapping and/or compacting data includes reducing a first quantity of write operations that are received from a host to a second quantity of write operations for programming to a page of a memory device that are within the specifications of partial page write operations for the memory device. The second quantity of write operations can also remap data that were originally intended to be programmed to memory address ranges that conflict with a memory map of the memory device.

Abstract: Methods for remapping and/or compacting data in memory devices, memory devices, and systems are disclosed. One such method of remapping and/or compacting data includes reducing a first quantity of write operations that are received from a host to a second quantity of write operations for programming to a page of a memory device that are within the specifications of partial page write operations for the memory device. The second quantity of write operations can also remap data that were originally intended to be programmed to memory address ranges that conflict with a memory map of the memory device.

Abstract: The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.

Abstract: Methods for remapping and/or compacting data in memory devices, memory devices, and systems are disclosed. One such method of remapping and/or compacting data includes reducing a first quantity of write operations that are received from a host to a second quantity of write operations for programming to a page of a memory device that are within the specifications of partial page write operations for the memory device. The second quantity of write operations can also remap data that were originally intended to be programmed to memory address ranges that conflict with a memory map of the memory device.

Abstract: A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate.

Abstract: A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.

Abstract: The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.