Patents by Inventor Jim Dobbins

Jim Dobbins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10685925
    Abstract: Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: June 16, 2020
    Assignee: NVIDIA CORPORATION
    Inventors: Jim Dobbins, Sheetal Jain, Don Templeton, Yaping Zhou, Wenjun Shi, Sunil Sudhakaran
  • Patent number: 10600730
    Abstract: In one embodiment, a system comprises: a plurality of aggressor bus lines; and a plurality of differential pair bus lines that are located in relatively parallel close proximity to the plurality of aggressor bus lines, wherein at least two of the plurality of differential pair bus lines change location with respect to each other at a point that has a cancelling affect on cross talk from the plurality of aggressor bus lines, wherein the change includes cross over routing. The plurality of differential pair bus lines can convey differential clock signals. The routing of the plurality of differential pair bus lines is substantially parallel to one another before and after the change.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: March 24, 2020
    Assignee: NVIDIA CORPORATION
    Inventors: Jim Dobbins, Sheetal Jain, Don Templeton, Yaping Zhou, Wenjun Shi, Sunil Sudhakaran
  • Publication number: 20190237399
    Abstract: In one embodiment, a system comprises: a plurality of aggressor bus lines; and a plurality of differential pair bus lines that are located in relatively parallel close proximity to the plurality of aggressor bus lines, wherein at least two of the plurality of differential pair bus lines change location with respect to each other at a point that has a cancelling affect on cross talk from the plurality of aggressor bus lines, wherein the change includes cross over routing. The plurality of differential pair bus lines can convey differential clock signals. The routing of the plurality of differential pair bus lines is substantially parallel to one another before and after the change.
    Type: Application
    Filed: January 26, 2018
    Publication date: August 1, 2019
    Inventors: Jim Dobbins, Sheetal Jain, Don Templeton, Yaping Zhou, Wenjun Shi, Sunil Sudhakaran
  • Publication number: 20190237417
    Abstract: Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).
    Type: Application
    Filed: January 26, 2018
    Publication date: August 1, 2019
    Inventors: Jim Dobbins, Sheetal Jain, Don Templeton, Yaping Zhou, Wenjun Shi, Sunil Sudhakaran