Abstract: A chip-on-glass device comprises a chip-on-glass substrate, a metal layer, and a plurality of chip-on-glass connection bumps. The metal layer comprises a plurality of passive jumper routing traces. The plurality of chip-on-glass connection humps is coupled with passive jumper routing traces of the plurality of passive jumper routing traces.

Abstract: A capacitive input device has a sensor electrode pattern disposed on a first side of a substrate. The sensor electrode pattern comprises a plurality of sensor electrode elements disposed on the first side of a first substrate. A plurality of routing traces is disposed along a first edge of the sensor electrode pattern on the first side of the substrate and configured to communicatively couple at least some of the sensor electrodes with a processing system. A pair of guard traces is disposed in the same layer as and brackets the plurality of routing traces. A guard overlaps the routing traces, is disposed proximate the routing traces on the first side of the substrate, and ohmically couples the pair of guard traces with one another. A second insulator is disposed between the routing traces and the guard. The second insulator and the first insulator are disposed in the same layer.

Abstract: A capacitive input device includes first and second pluralities of sensor electrodes disposed in a first region of a substrate. The first and second pluralities of sensor electrodes are substantially orthogonal to one another. The first region is configured to overlap a display screen. At least one routing trace is disposed in a second region of the substrate and is ohmically coupled to a sensor electrode of one of the first and second pluralities of sensor electrodes and also to a processing system. The second region comprises a non-display screen overlapping portion of the substrate. A compensation trace is disposed in the second region and ohmically coupled to the processing system. The compensation trace has substantially the same length as and is substantially parallel and proximate to the at least one routing trace. The compensation trace is not ohmically coupled to any sensor electrode located in the first region.

Abstract: A chip-on-glass device comprises a chip-on-glass substrate, a metal layer, and a plurality of chip-on-glass connection bumps. The metal layer comprises a plurality of passive jumper routing traces. The plurality of chip-on-glass connection humps is coupled with passive jumper routing traces of the plurality of passive jumper routing traces.

Abstract: A capacitive input device has a sensor electrode pattern disposed on a first side of a substrate. The sensor electrode pattern comprises a plurality of sensor electrode elements disposed on the first side of a first substrate. A plurality of routing traces is disposed along a first edge of the sensor electrode pattern on the first side of the substrate and configured to communicatively couple at least some of the sensor electrodes with a processing system. A pair of guard traces is disposed in the same layer as and brackets the plurality of routing traces. A guard overlaps the routing traces, is disposed proximate the routing traces on the first side of the substrate, and ohmically couples the pair of guard traces with one another. A second insulator is disposed between the routing traces and the guard. The second insulator and the first insulator are disposed in the same layer.

Abstract: A capacitive input device includes first and second pluralities of sensor electrodes disposed in a first region of a substrate. The first and second pluralities of sensor electrodes are substantially orthogonal to one another. The first region is configured to overlap a display screen. At least one routing trace is disposed in a second region of the substrate and is ohmically coupled to a sensor electrode of one of the first and second pluralities of sensor electrodes and also to a processing system. The second region comprises a non-display screen overlapping portion of the substrate. A compensation trace is disposed in the second region and ohmically coupled to the processing system. The compensation trace has substantially the same length as and is substantially parallel and proximate to the at least one routing trace. The compensation trace is not ohmically coupled to any sensor electrode located in the first region.

Abstract: The invention provides a method and apparatus for evaluating the product quality and performances of micromirror array devices through measurements of the electromechanical responses of the individual micromirrors to the driving forces of electric fields. The electromechanical responses of the micromirrors according to the present invention are described in terms of the rotational angles associated with the operational states, such as the ON and OFF state angles of the ON and OFF state when the micromirror array device is operated in the binary-state mode, and the response speed (i.e. the time interval required for a micromirror device to transit form one state to another) of the individual micromirrors to the driving fields.

Abstract: The invention provides a method and apparatus for evaluating the product quality and performances of micromirror array devices through measurements of the electromechanical responses of the individual micromirrors to the driving forces of electric fields. The electromechanical responses of the micromirrors according to the present invention are described in terms of the rotational angles associated with the operational states, such as the ON and OFF state angles of the ON and OFF state when the micromirror array device is operated in the binary-state mode, and the response speed (i.e. the time interval required for a micromirror device to transit form one state to another) of the individual micromirrors to the driving fields.

Abstract: An optical beam-shaping unit comprises a fly-eye lens for modifying light beams into modified light beams with desired profiles. The optical beam-shaping unit is especially useful in modifying collimated light from solid-state illuminators, such as laser sources.

Abstract: The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.

Abstract: The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.

Abstract: The invention provides a method and apparatus for evaluating the product quality and performances of micromirror array devices through measurements of the electromechanical responses of the individual micromirrors to the driving forces of electric fields. The electromechanical responses of the micromirrors according to the present invention are described in terms of the rotational angles associated with the operational states, such as the ON and OFF state angles of the ON and OFF state when the micromirror array device is operated in the binary-state mode, and the response speed (i.e. the time interval required for a micromirror device to transit form one state to another) of the individual micromirrors to the driving fields.

Abstract: The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.

Abstract: The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.

Abstract: The present invention provides a packaged microelectromechanical device having a plurality of deflectable elements formed on a substrate that has a getter and/or a lubricant disposed thereon. The substrate can be a glass substrate or a semiconductor wafer. The lubricant and/or getter can be disposed on the substrate or held by one or more containers that are attached to the substrate.

Abstract: A micromirror device comprises a plurality of stopping mechanisms that sequentially stop the mirror plate of the micromirror device when the micromirror device is rotating towards a state, such as an ON or OFF state. The mirror plate sequentially separates from the stopping mechanisms when the mirror plate is rotating towards another state, such as the OFF or ON state.