Patents by Inventor Jim Fair

Jim Fair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rapid thermal annealing using thermally conductive overcoat
    Patent number: 5523262
    Abstract: Apparatus and method for improved heating uniformity during rapid thermal annealing through the use of a sacrificial layer covering the surface to be annealed. The composition and thickness of the layer are chosen to be opaque at the frequencies emitted by a radiant energy source, usually a xenon arc lamp, and also to be thermally conductive. The sacrificial layer absorbs the radiant energy and conducts the resulting heat to the surface to be annealed. After the annealing is complete, the sacrificial layer is etched away or left as an overcoat.
    Type: Grant
    Filed: January 14, 1994
    Date of Patent: June 4, 1996
    Assignee: Intevac, Inc.
    Inventors: Jim Fair, John Mehlhaff
  • Rapid thermal annealing using thermally conductive overcoat
    Patent number: 5336641
    Abstract: Method for improved heating uniformity during rapid thermal annealing through the use of a sacrificial layer covering the surface to be annealed. The composition and thickness of the layer are chosen to be opaque at the frequencies emitted by a radiant energy source, usually a xenon arc lamp, and also to be thermally conductive. The sacrificial layer absorbs the radiant energy and conducts the resulting heat to the surface to be annealed. After the annealing is complete, the sacrificial layer is etched away or left as an overcoat.
    Type: Grant
    Filed: March 17, 1992
    Date of Patent: August 9, 1994
    Assignee: Aktis Corporation
    Inventors: Jim Fair, John Mehlhaff