Patents by Inventor Jim G. Hunter

Jim G. Hunter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microstructure plating systems
    Patent number: 9758364
    Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: September 12, 2017
    Assignee: Honeywell International Inc.
    Inventors: Gordon A. Shaw, Daniel Baseman, Chris Finn, Jim G. Hunter
  • MICROSTRUCTURE PLATING SYSTEMS AND METHODS
    Publication number: 20170001856
    Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
    Type: Application
    Filed: May 23, 2016
    Publication date: January 5, 2017
    Inventors: Gordon A. Shaw, Daniel Baseman, Chris Finn, Jim G. Hunter
  • Microstructure plating systems and methods
    Patent number: 9371222
    Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 21, 2016
    Assignee: Honeywell International Inc.
    Inventors: Gordon A. Shaw, Daniel Baseman, Chris Finn, Jim G. Hunter
  • ULTRASOUND LIQUID DISPERSION HUMIDIFIER
    Publication number: 20140260710
    Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Gordon A. Shaw, Daniel Baseman, Chris Finn, Jim G. Hunter