Abstract: A knock-out in the wall of the housing for electronic equipment is selectively removed to provide a knock-out opening. A wall includes first and second slits positioned along the boundary of the knock-out and separated by a land. The wall includes a break out opening adjacent to each land. Break portions of the wall separate the break out opening from the first and second slits. These break portions are severed to interconnect the first and second slits through the break out opening and permit removal of the knock-out. Plural such slits and break out openings are provided and arranged to provide a knock out of rectangular or other desired geometric shape. The slits and break out openings are sized to provide electromagnetic interference shielding. Also, the break portions are of a length which is approximately no greater than the thickness of the wall and are positioned to facilitate removal of the knock-out without deforming the wall and without leaving burrs in the knock-out opening.