Abstract: The disclosed embodiments provide a system that transfers data from a storage device to a host. The system includes a communication mechanism that receives a request to read a set of blocks from the host. Next, upon reading each block from the set of blocks from the storage device, the communication mechanism transfers the block over an interface with the host. The system also includes an error-detection apparatus that performs error detection on the block upon reading the block, and an error-correction apparatus that performs error correction on the block if an error is detected in the block. The communication mechanism may then retransfer the block to the host after the error is removed from the block.

Abstract: The disclosed embodiments provide a system that transfers data from a storage device to a host. The system includes a communication mechanism that receives a request to read a set of blocks from the host. Next, upon reading each block from the set of blocks from the storage device, the communication mechanism transfers the block over an interface with the host. The system also includes an error-detection apparatus that performs error detection on the block upon reading the block, and an error-correction apparatus that performs error correction on the block if an error is detected in the block. The communication mechanism may then retransfer the block to the host after the error is removed from the block.

Abstract: The disclosed embodiments provide a system that transfers data from a storage device to a host. The system includes a communication mechanism that receives a request to read a set of blocks from the host. Next, upon reading each block from the set of blocks from the storage device, the communication mechanism transfers the block over an interface with the host. The system also includes an error-detection apparatus that performs error detection on the block upon reading the block, and an error-correction apparatus that performs error correction on the block if an error is detected in the block. The communication mechanism may then retransfer the block to the host after the error is removed from the block.

Abstract: The disclosed embodiments provide a system that transfers data from a storage device to a host. The system includes a communication mechanism that receives a request to read a set of blocks from the host. Next, upon reading each block from the set of blocks from the storage device, the communication mechanism transfers the block over an interface with the host. The system also includes an error-detection apparatus that performs error detection on the block upon reading the block, and an error-correction apparatus that performs error correction on the block if an error is detected in the block. The communication mechanism may then retransfer the block to the host after the error is removed from the block.

Abstract: A kernel-mode graphics driver (e.g., a D3D driver running under Microsoft Windows) exploits the parallelism available in a dual-core computer system. When an application thread invokes the kernel-mode graphics driver, the driver creates a second (“auxiliary”) thread and binds the application thread to a first one of the processing cores. The auxiliary thread, which generates instructions to the graphics hardware, is bound to a second processing core. The application thread transmits each graphics-driver command to the auxiliary thread, which executes the command. The application thread and auxiliary thread can execute synchronously or asynchronously.

Abstract: A multi purpose hand tool includes an elongate generally cylindrical handle having opposite first and second ends. The handle is adapted for grasping by a user and has a hole through the handle located substantially mid-way along the length of the handle. The hole extends through the handle so that a digit of the user's hand, when grasping the handle, may be inserted through the hole.

Abstract: A multi purpose hand tool includes an elongate generally cylindrical handle having opposite first and second ends. The handle is adapted for grasping by a user and has a hole through the handle located substantially mid-way along the length of the handle. The hole extends through the handle so that a digit of the user's hand, when grasping the handle, may be inserted through the hole.

Abstract: A method for preparing a semiconductor wafer surface is provided which includes providing a plurality of source inlets and a plurality of source outlets and applying isopropyl alcohol (IPA) vapor gas through the plurality of source inlets to the wafer surface when the plurality of source inlets and outlets are in close proximity to the wafer surface. The method also includes applying a fluid through the plurality of source inlets to the wafer surface while applying the IPA vapor gas, and removing the applied IPA vapor gas and fluid from the wafer surface through the plurality of source outlets.

Abstract: A method for preparing a semiconductor wafer surface is provided which includes providing a plurality of source inlets and a plurality of source outlets and applying isopropyl alcohol (WPA) vapor gas through the plurality of source inlets to the wafer surface when the plurality of source inlets and outlets are in close proximity to the wafer surface. The method also includes applying a fluid through the plurality of source inlets to the wafer surface while applying the IPA vapor gas, and removing the applied IPA vapor gas and fluid from the wafer surface through the plurality of source outlets.

Abstract: A wafer cleaner and dryer to be used in wafer manufacturing operations is provided. The wafer cleaner and dryer has a proximity head which moves toward a wafer surface to complete either a cleaning or a drying operation. The proximity head includes a plurality of source inlets where the plurality of source inlets generates a first pressure on a fluid film present on the wafer surface when the proximity head is in a first position that is close to the wafer surface. The proximity head also contains a plurality of source outlets which introduces a second pressure on the fluid film present on the wafer surface when the proximity head is in the first position. The first pressure generated by the plurality of source inlets is greater than the second pressure created by the plurality of source outlets so as to create a pressure difference where the pressure difference causes removal of the fluid film from the wafer surface.