Abstract: Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The buffers allow the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffers. The second sub-interface is between the buffers and the memory modules. The method also includes interleaving output of the buffers, and configuring the buffers to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Abstract: Buffering data transfer between a chipset and memory modules is disclosed. The disclosure includes providing and configuring at least one buffer. The buffers are provided in an interface between a chipset and memory modules. The buffers allow the interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the at least one buffer. The second sub-interface is between the at least one buffer and the memory modules. The buffers are then configured to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Abstract: Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The buffers allow the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffers. The second sub-interface is between the buffers and the memory modules. The method also includes interleaving output of the buffers, and configuring the buffers to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Abstract: Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The buffers allow the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffers. The second sub-interface is between the buffers and the memory modules. The method also includes interleaving output of the buffers, and configuring the buffers to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Abstract: A plurality of memory modules interface through a daisy-chain providing a point-to-point connection for each memory module. The first and the last memory module in the daisy chain each connect to a separate memory controller port forming a ring circuit. A distinct set of signals connect the memory modules in each direction. A junction circuit in each memory module provides line isolation, a coupling to the adjoining memory modules in the daisy chain, or in the case of the first and last memory module in the daisy chain, a memory module and a memory controller, and a data synchronization circuit. Each junction circuit provides as well as voltage conversion so that the memory devices on a memory module operate at a different voltage than the memory controller, and multiplexing/de-multiplexing so that a lesser number of lines interface with each junction circuit.

Abstract: Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The at least one buffer allows the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffer. The second sub-interface is between the buffer and the memory modules. The method also includes interleaving output of the memory ranks in the memory modules, and configuring the at least one buffer to properly latch data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Abstract: A memory containing a plurality of memory banks and a plurality of sense amplifiers. Also, the memory device contains a multiplexer and logic. The logic receives a refresh request for one of the plurality of memory banks and instructs the multiplexer to select one of the plurality of sense amplifiers in response to the refresh request.

Abstract: A plurality of memory modules interface through a daisy-chain providing a point-to-point connection for each memory module. The first and the last memory module in the daisy chain each connect to a separate memory controller port forming a ring circuit. A distinct set of signals connect the memory modules in each direction. A junction circuit in each memory module provides line isolation, a coupling to the adjoining memory modules in the daisy chain, or in the case of the first and last memory module in the daisy chain, a memory module and a memory controller, and a data synchronization circuit. Each junction circuit provides as well as voltage conversion so that the memory devices on a memory module operate at a different voltage than the memory controller, and multiplexing/de-multiplexing so that a lesser number of lines interface with each junction circuit.