Abstract: An LSI fabrication process employs pulsed laser energy to selectively tailor individual logic elements of which the building blocks of an LSI array may be configured and to selectively interconnect these laser-configured building blocks. On an LSI chip, an array of universal logic devices or building blocks may be formed together with a matrix pattern of intrablock pathways or signal channels through which the building blocks may be tested and selectively interconnected in order that a prescribed LSI configured system or subsystem may be formed.