Patents by Inventor Jim M. Spall

Jim M. Spall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
    Patent number: 7808788
    Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: October 5, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Kevin M. Gertiser, Richard A. Ripple, Michael J. Lowry, Karl A. Schten, Ronald M. Shearer, Jim M. Spall
  • Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
    Publication number: 20090002950
    Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventors: Kevin M. Gertiser, Richard A. Ripple, Michael J. Lowry, Karl A. Schten, Ronald M. Shearer, Jim M. Spall