Patents by Inventor Jim Machir
Jim Machir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11085837Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: GrantFiled: August 20, 2019Date of Patent: August 10, 2021Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Patent number: 10732057Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.Type: GrantFiled: November 15, 2018Date of Patent: August 4, 2020Assignee: Honeywell International Inc.Inventors: Josh M. Fribley, Lamar Floyd Ricks, Richard Wade, Jim Machir, Richard Alan Davis
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Publication number: 20200003637Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: ApplicationFiled: August 20, 2019Publication date: January 2, 2020Applicant: Honeywell International Inc.Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Patent number: 10444090Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: GrantFiled: May 15, 2017Date of Patent: October 15, 2019Assignee: Honeywell International Inc.Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Publication number: 20190101461Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.Type: ApplicationFiled: November 15, 2018Publication date: April 4, 2019Inventors: Josh M. Fribley, Lamar Floyd Ricks, Richard Wade, Jim Machir, Richard Alan Davis
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Patent number: 10190925Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.Type: GrantFiled: July 18, 2016Date of Patent: January 29, 2019Assignee: Honeywell International Inc.Inventors: Josh M. Fribley, Lamar Floyd Ricks, Richard Wade, Jim Machir, Richard Alan Davis
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Publication number: 20180328800Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: ApplicationFiled: May 15, 2017Publication date: November 15, 2018Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Patent number: 10094726Abstract: Embodiments generally relate to assembly and methods for detecting force. A force sensor assembly may comprise a sense element, an isolation medium, a thin membrane, and a substrate. Typically, the sense element may be located adjacent to the substrate, the isolation medium may be located adjacent to the sense element, and the thin membrane may be located adjacent to the isolation medium. Generally, the thin membrane may be configured to provide a shield between an external medium and the isolation medium and transfer a force from the external medium to the isolation medium. In this manner, the isolation medium may be configured to transfer the detected force to the sense element. The sense element may electrically communicate the force data as output signals to the electrical traces on the substrate.Type: GrantFiled: February 1, 2017Date of Patent: October 9, 2018Assignee: Honeywell International Inc.Inventors: Todd Eckhardt, Jim Machir, Ron Myers
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Publication number: 20180217018Abstract: Embodiments generally relate to assembly and methods for detecting force. A force sensor assembly may comprise a sense element, an isolation medium, a thin membrane, and a substrate. Typically, the sense element may be located adjacent to the substrate, the isolation medium may be located adjacent to the sense element, and the thin membrane may be located adjacent to the isolation medium. Generally, the thin membrane may be configured to provide a shield between an external medium and the isolation medium and transfer a force from the external medium to the isolation medium. In this manner, the isolation medium may be configured to transfer the detected force to the sense element. The sense element may electrically communicate the force data as output signals to the electrical traces on the substrate.Type: ApplicationFiled: February 1, 2017Publication date: August 2, 2018Inventors: Todd Eckhardt, Jim Machir, Ron Myers
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Publication number: 20180017449Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.Type: ApplicationFiled: July 18, 2016Publication date: January 18, 2018Inventors: Josh M. Fribley, Lamar Floyd Ricks, Richard Wade, Jim Machir, Richard Alan Davis
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Patent number: 8934263Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.Type: GrantFiled: August 1, 2011Date of Patent: January 13, 2015Assignee: Honeywell International Inc.Inventors: Todd Eckhardt, Jim Machir, Palani Thanigachalam, Sunil Job
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Patent number: 8817483Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.Type: GrantFiled: August 1, 2011Date of Patent: August 26, 2014Assignee: Honeywell International Inc.Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
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Patent number: 8671753Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cable harness assembly for connection with a sensor assembly may include a cable cover having a first end and a second end, a cable extending through an opening in the first end of the of the cable cover, and a crimp ring configured to engage the cable at a position within the cable cover, such that the attached crimp ring may not fit through the opening. The second end of the cable cover may be configured to connect to a housing of an electrical connector. Further, the cable may have wires that may be configured to electrically connect to electrical terminals of the electrical connector. In some instances, the electrical connector may be electrically connected to a sensor.Type: GrantFiled: August 1, 2011Date of Patent: March 18, 2014Assignee: Honeywell International Inc.Inventors: Todd Eckhardt, Pavan R. Kashyap, Jim Machir, Palani Thanigachalam
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Patent number: 8656786Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.Type: GrantFiled: August 1, 2011Date of Patent: February 25, 2014Assignee: Honeywell International Inc.Inventors: Ryan Jones, Todd Eckhardt, Jim Machir, Richard Wade
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Patent number: 8534130Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer.Type: GrantFiled: August 1, 2011Date of Patent: September 17, 2013Assignee: Honeywell International Inc.Inventors: Todd Eckhardt, Alistair David Bradley, Sunil Job, Palani Thanigachalam, Jim Machir
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Publication number: 20130033830Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.Type: ApplicationFiled: August 1, 2011Publication date: February 7, 2013Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
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Publication number: 20130031976Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cable harness assembly for connection with a sensor assembly may include a cable cover having a first end and a second end, a cable extending through an opening in the first end of the of the cable cover, and a crimp ring configured to engage the cable at a position within the cable cover, such that the attached crimp ring may not fit through the opening. The second end of the cable cover may be configured to connect to a housing of an electrical connector. Further, the cable may have wires that may be configured to electrically connect to electrical terminals of the electrical connector. In some instances, the electrical connector may be electrically connected to a sensor.Type: ApplicationFiled: August 1, 2011Publication date: February 7, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Todd Eckhardt, Pavan R. Kashyap, Jim Machir, Palani Thanigachalam
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Publication number: 20130031986Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer.Type: ApplicationFiled: August 1, 2011Publication date: February 7, 2013Inventors: Todd Eckhardt, Alistair David Bradley, Sunil Job, Palani Thanigachalam, Jim Machir
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Publication number: 20130033841Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.Type: ApplicationFiled: August 1, 2011Publication date: February 7, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Todd Eckhardt, Jim Machir, Palani Thanigachalam, Sunil Job
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Publication number: 20130031984Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.Type: ApplicationFiled: August 1, 2011Publication date: February 7, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Ryan Jones, Todd Eckhardt, Jim Machir, Richard Wade