Abstract: A touch sensor assembly may include a cover, an electrode film assembly, an adhesive layer, a printed circuit board (PCB) electrically connected to the electrode film and a back plate configured to be coupled to the cover with the PCB and the electrode film assembly disposed between the housing and the back plate. The electrode film assembly may include an electrode film formed from a conductive ink and may comprise a plurality of contacts corresponding to a plurality of touch areas. The electrode film assembly may optionally comprise capacitive circuitry configured to exhibit a capacitance response to contact with the touch areas. The adhesive layer may be configured to secure the electrode film assembly to the cover. The PCB may be substantially planar and the cover may include an inner surface having a curvature. The electrode film may be configured to substantially conform to the curvature when secured thereto.

Abstract: A touch sensor assembly may include a cover, an electrode film assembly, an adhesive layer, a printed circuit board (PCB) electrically connected to the electrode film and a back plate configured to be coupled to the cover with the PCB and the electrode film assembly disposed between the housing and the back plate. The electrode film assembly may include an electrode film formed from a conductive ink and may comprise a plurality of contacts corresponding to a plurality of touch areas. The electrode film assembly may optionally comprise capacitive circuitry configured to exhibit a capacitance response to contact with the touch areas. The adhesive layer may be configured to secure the electrode film assembly to the cover. The PCB may be substantially planar and the cover may include an inner surface having a curvature. The electrode film may be configured to substantially conform to the curvature when secured thereto.