Patents by Inventor Jim Michael Mrvos

Jim Michael Mrvos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6704996
    Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: March 16, 2004
    Assignee: Lexmark International, Inc.
    Inventors: Jim Michael Mrvos, George Keith Parish, Kristi Maggard Rowe
  • Publication number: 20030202050
    Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.
    Type: Application
    Filed: February 3, 2003
    Publication date: October 30, 2003
    Inventors: Jim Michael Mrvos, George Keith Parish, Kristi Maggard Rowe
  • Patent number: 6540334
    Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: April 1, 2003
    Assignee: Lexmark International, Inc.
    Inventors: Jim Michael Mrvos, George Keith Parish, Kristi Maggard Rowe