Patents by Inventor Jim Noval

Jim Noval has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing process for a radial fin heat sink
    Patent number: 6705144
    Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive base having substantially planar upper and lower surfaces, the upper surface is disposed across from the lower surface, and the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends angularly away from the upper surface of the base. The array has a chamber within to house an air movement device so that the air introduced by the air movement device creates a swirling air movement over the heat exchange portion to increase air movement around the heat exchange portion to enhance the heat extraction from the heat exchange portion.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: March 16, 2004
    Assignee: Intel Corporation
    Inventors: Lloyd L. Pollard, II, Murli Tirumala, Jim Noval
  • MANUFACTURING PROCESS FOR A RADIAL FIN HEAT SINK
    Publication number: 20030046967
    Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive base having substantially planar upper and lower surfaces, the upper surface is disposed across from the lower surface, and the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends angularly away from the upper surface of the base. The array has a chamber within to house an air movement device so that the air introduced by the air movement device creates a swirling air movement over the heat exchange portion to increase air movement around the heat exchange portion to enhance the heat extraction from the heat exchange portion.
    Type: Application
    Filed: September 10, 2001
    Publication date: March 13, 2003
    Applicant: Intel Corporation
    Inventors: Lloyd L. Pollard, Murli Tirumala, Jim Noval