Abstract: A heater that may be applied to a substrate. The heater may include a graduating material deposited on at least a portion of a substrate, a resistive material and a thermal barrier dielectric coating. The resistive material may include at least two resistive compositions, wherein the resistivity of the material may be altered by varying the composition in given areas.

Abstract: An electrical connector assembly for an arcuate surface in a high temperature environment and associated method of use is disclosed for a variety of applications. This can include, but is not limited to, an injection molding heater assembly having at least one heater and an injection molding heater and nozzle assembly having at least one heater and a nozzle that is in thermal communication with the at least one heater. This at least one electrical connector, having a first electrical conductor that is electrically connectable to at least one first conductive portion on at least one arcuate surface and a second electrical conductor that is electrically connectable to at least one second conductive portion on the at least one arcuate surface, and at least one disconnect mechanism positioned adjacent to the at least one electrical connector and in electrical connection with the first electrical conductor and the second electrical conductor.

Abstract: A controller for at least one heater utilized in a hot runner injection molding system, which includes a regulated voltage supply that is electrically connected to the at least one heater utilized in a hot runner injection molding system, at least one sensor operatively associated with at least one heater and utilized in a hot runner injection molding system, at least one digital signal processor that is operatively connected to the at least one heater utilized in a hot runner injection molding system, the regulated voltage supply and the sensor operatively associated with the at least one heater utilized in a hot runner injection molding system based on feedback from the at least one sensor.

Abstract: The present disclosure relates to a heater that may be applied to a substrate. The heater may include a graduating material deposited on at least a portion of a substrate, a resistive material and a thermal barrier dielectric coating. The resistive material may include at least two resistive compositions, wherein the resistivity of the material may be altered by varying the composition in given areas.

Abstract: A controller for at least one heater utilized in an injection molding system, which includes a regulated voltage supply that is electrically connected to the at least one heater utilized in an injection molding system, at least one sensor operatively associated with at least one heater and utilized in an injection molding system, at least one digital signal processor that is operatively connected to the at least one heater utilized in an injection molding system, the regulated voltage supply and the sensor operatively associated with the at least one heater utilized in an injection molding system based on feedback from the at least one sensor.

Abstract: A controller for at least one heater utilized in an injection molding system, which includes a regulated voltage supply that is electrically connected to the at least one heater utilized in an injection molding system, at least one sensor operatively associated with at least one heater and utilized in an injection molding system, at least one digital signal processor that is operatively connected to the at least one heater utilized in an injection molding system, the regulated voltage supply and the sensor operatively associated with the at least one heater utilized in an injection molding system based on feedback from the at least one sensor.

Abstract: A controller for at least one heater, which includes a regulated voltage supply that is electrically connected to the at least one heater, at least one sensor operatively associated with at least one heater, at least one digital signal processor that is operatively connected to the at least one heater utilized in an injection molding system, the regulated voltage supply and the sensor operatively associated with the at least one heater based on feedback from the at least one sensor.

Abstract: A controller for at least one heater utilized in a hot runner injection molding system, which includes a regulated voltage supply that is electrically connected to the at least one heater utilized in a hot runner injection molding system, at least one sensor operatively associated with at least one heater and utilized in a hot runner injection molding system, at least one digital signal processor that is operatively connected to the at least one heater utilized in a hot runner injection molding system, the regulated voltage supply and the sensor operatively associated with the at least one heater utilized in a hot runner injection molding system based on feedback from the at least one sensor.

Abstract: A thick-film electric heater having thick-film layers applied directly on a thermally conductive non-flat substrate. Preferably, the substrate is cylindrically shaped. A dielectric layer is silk-screened on the substrate surface. A resistive layer is silk-screened on the dielectric layer to form a circuit for the generation of heat. The resistive layer has at least one resistive trace in a pattern that is discontinuous circumferentially. At least a pair of silk-screened contact pads are applied in electrical communication with the resistive layer for electrical connection to a power source. An insulation layer is applied over the resistive layer.

Abstract: An injection molding system injection molding system having at least one heater with an arcuate surface and a nozzle that is in thermal communication with the heater and an associated method of use. This injection molding system includes an electrical connector assembly for a heater having at least one electrical connector with a first electrical conductor that is electrically connectable to at least one first conductive portion on a heater and a second electrical conductor that is electrically connectable to at least one second conductive portion on the heater, and at least one disconnect mechanism positioned adjacent to the at least one electrical connector and in electrical connection with the first electrical conductor and the second electrical conductor. An injection molding system can include, but is not limited to, a hot runner system.

Abstract: An electrical connector assembly for an arcuate surface in a high temperature environment and associated method of use is disclosed for a variety of applications. This can include, but is not limited to, an injection molding heater assembly having at least one heater and an injection molding heater and nozzle assembly having at least one heater and a nozzle that is in thermal communication with the at least one heater. This at least one electrical connector, having a first electrical conductor that is electrically connectable to at least one first conductive portion at least one arcuate surface and a second electrical conductor that is electrically connectable to at least one second conductive portion on the at least one arcuate surface, and at least one disconnect mechanism positioned adjacent to the at least one electrical connector and in electrical connection with the first electrical conductor and the second electrical conductor.

Abstract: Disclosed is a kit of a molding system, a valve of a molding system, and a molding system. Each of the kit and the molding system includes a pump configured to be placed in a valve pathway defined by a valve, wherein the pump is configured to pump, responsive to actuation by a pump actuator, a molding material through the valve pathway and towards a mold cavity defined by complementary mold halves. The valve includes a valve body and a pump configured to be placed in a valve pathway defined by the valve body, wherein the pump is configured to pump, responsive to actuation by a pump actuator, a molding material through the valve pathway and towards a mold cavity defined by complementary mold halves.

Abstract: A method and apparatus for connection of a conductor to a thick film pad is disclosed. Pressure and frictional force are combined to produce a reliable metallurgical bond between the conductor and the thick film pad.