Patents by Inventor Jim Protsenko

Jim Protsenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070116626
    Abstract: Methods for forming thermal pads including arrays of vertically aligned carbon nanotubes are provided. The thermal pads are formed on various substrates, including foils, thin self-supporting polished metals, semiconductor dies, heat management aids, and lead frames. The arrays are growth from a catalyst layer disposed on the substrate. Forming the array can include leaving the ends of the nanotubes unfinished, attaching a foil thereto, or coating the ends with a metal layer. The metal layer coating can then be polished to a desired smoothness. The array can be filled with a matrix material, only partially filled, or left unfilled. Where the substrate is a foil, the method can be a continuous process where foil is taken from a roll and fed through a series of formation steps. Where the substrate is a lead frame, heating can be generated by applying an current to a pad of the lead frame.
    Type: Application
    Filed: May 11, 2006
    Publication date: May 24, 2007
    Inventors: Lawrence Pan, Srinivas Rao, Jim Protsenko, Gang Gu
  • Publication number: 20070116957
    Abstract: Thermal pads, including free-standing examples, are provided for dissipating heat from a heat source like a semiconductor die to a heat management aid such as a heat sink. The thermal pads include a sheet of vertically aligned carbon nanotubes and a surface layer. One such surface layer has a thickness of less than 500 microns. Another includes a metal layer having a thickness of less than 500 microns and an intermediate layer attaching the metal layer to the sheet of carbon nanotubes.
    Type: Application
    Filed: May 11, 2006
    Publication date: May 24, 2007
    Inventors: Lawrence Pan, Srinivas Rao, Jim Protsenko, Gang Gu
  • Publication number: 20060255450
    Abstract: Devices and methods for their manufacture are provided. The devices, such as packaged semiconductors, include thermal pads of vertically aligned carbon nanotubes to transport heat from a heat source such as a semiconductor die, to or between thermal management aids such as a heat spreader or heat sink. Some devices include spacers between the heat spreader and the heat sink to protect the thermal pad during assembly. Other devices include thermal pads that have surface layers matched by composition to the surfaces of the opposing surfaces, thus silicon on one side and a metal on the other. In some devices, the ends of the carbon nanotubes extend into the surface of the thermal management aid. Methods for bonding the thermal pads include bonding surface layers, as well as exposed carbon nanotubes, to opposing surfaces.
    Type: Application
    Filed: May 11, 2006
    Publication date: November 16, 2006
    Inventors: Lawrence Pan, Srinivas Rao, Jim Protsenko
  • Publication number: 20060258054
    Abstract: Methods for producing carbon nanotube thermal pads comprise forming an array of carbon nanotubes on a catalyst layer on a substrate and releasing the array from the substrate. The carbon nanotubes are grown so that they are generally vertically aligned relative to the substrate. Releasing the array can include dissolving the substrate. Alternately, a release layer between the substrate and the catalyst layer can be employed. The release layer can be chemically removed, or can provide a low-strength interface that is easily pulled apart or sheared.
    Type: Application
    Filed: May 11, 2006
    Publication date: November 16, 2006
    Inventors: Lawrence Pan, Srinivas Rao, Jim Protsenko, Gang Gu
  • Publication number: 20060251897
    Abstract: Methods for joining two objects through the growth of carbon nanotubes from one or both of two opposing surfaces of the two objects, and interfaces formed between the two objects, are provided. Carbon nanotubes grown from both of the opposing surfaces can interdigitate to secure the two objects together. A metal layer can also be placed on one of the opposing surfaces such that carbon nanotubes growing from the other opposing surface bond with the metal layer. In addition to the mechanical bond, the carbon nanotubes can also provide thermal and electrical conductivity between the objects.
    Type: Application
    Filed: May 6, 2005
    Publication date: November 9, 2006
    Inventors: Lawrence Pan, Gang Gu, Jim Protsenko
  • Publication number: 20060231946
    Abstract: A thermal interface includes an array of generally aligned carbon nanotubes joined to a surface with a metal layer. The array of carbon nanotubes includes a coating on the ends of the carbon nanotubes for improved wetting of the metal layer to the ends of the carbon nanotubes so that the thermal resistance at the interface between the carbon nanotubes ends and the metal is reduced. A semiconductor device that employs a thermal interface of the invention, and a method for fabricating the thermal interfaces are also provided.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 19, 2006
    Inventors: Lawrence Pan, Gang Gu, Jim Protsenko, Xuejiao Hu, Hongjie Dai, Srinivas Rao
  • Publication number: 20040200734
    Abstract: In one embodiment, the present invention provides for a nanotube-based sensor for detecting a biomolecule comprising one or a plurality of nanotubes, a first electrode and a second electrode connected to said nanotubes, a microfluidic system, and a plurality of immobilized biomolecules, wherein said plurality of immobilized biomolecules are immobilized on said plurality of nanotubes, said plurality of nanotubes are integrated to said microfluidic system, and said first electrode and said second electrode are connected to provide to electrical readout. In another embodiment, said plurality of immobilized biomolecules are immobilized on said substrate or said electrodes or the said microfluidics system. In another embodiment, the sensors are integrated to provide an array of sensors. The present invention further provides for methods to detect a biomolecule using the nanotube-based sensors or arrays of sensors.
    Type: Application
    Filed: December 19, 2003
    Publication date: October 14, 2004
    Inventors: Man Sung Co, Lian Zhang, Gang Gu, Lawrence Pan, Jim Protsenko