Patents by Inventor Jim Su
Jim Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9011638Abstract: A method of chip sorting comprises providing a chip holder having a first surface; providing multiple chips on the first surface; providing a chip receiver having a second surface, wherein the second surface faces the first surface; attaching the multiple chips to the second surface; decreasing an adhesion between the multiple chips and the first surface; and separating the multiple chips from the first surface after the step of decreasing the adhesion between the multiple chips and the first surface.Type: GrantFiled: March 19, 2014Date of Patent: April 21, 2015Assignee: Epistar CorporationInventors: Chen-Ke Hsu, Liang Sheng Chi, Chun-Chang Chen, Win-Jim Su, Hsu-Cheng Lin, Mei-Ling Tsai, Yi Lung Liu, Chen Ou
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Publication number: 20140202627Abstract: A method of chip sorting comprises providing a chip holder having a first surface; providing multiple chips on the first surface; providing a chip receiver having a second surface, wherein the second surface faces the first surface; attaching the multiple chips to the second surface; decreasing an adhesion between the multiple chips and the first surface; and separating the multiple chips from the first surface after the step of decreasing the adhesion between the multiple chips and the first surface.Type: ApplicationFiled: March 19, 2014Publication date: July 24, 2014Applicant: EPISTAR CORPORATIONInventors: Chen-Ke HSU, Liang Sheng CHI, Chun-Chang CHEN, Win-Jim SU, Hsu-Cheng LIN, Mei-Ling TSAI, Yi Lung LIU, Chen OU
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Patent number: 8753909Abstract: A light emitting device and a method of fabricating thereof are provided. The method of fabricating the light emitting device comprises: providing a substrate having a first major surface and a second major surface; forming a plurality of light-emitting stacks on the first major surface; forming an etching protection layer on each of the light emitting stacks; forming a plurality of holes by a discontinuous laser beam on the substrate; etching the plurality of holes; and slicing off the substrate along the plurality of holes to form a light emitting device. The light emitting device has a substrate wherein the sidewall of the substrate comprising a first area with a substantially flat surface and a second area with substantially textured surface.Type: GrantFiled: July 18, 2013Date of Patent: June 17, 2014Assignee: Epistar CorporationInventors: Chen-Ke Hsu, Win Jim Su, Chia-Ming Chuang, Chen Ou
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Patent number: 8714227Abstract: A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.Type: GrantFiled: July 23, 2010Date of Patent: May 6, 2014Assignee: Epistar CorporationInventors: Chen-Ke Hsu, Liang-Sheng Chi, Chun-Chang Chen, Win-Jim Su, Hsu-Cheng Lin, Mei-Ling Tsai, Yi Lung Liu, Chen Ou
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Publication number: 20130302927Abstract: A light emitting device and a method of fabricating thereof are provided. The method of fabricating the light emitting device comprises: providing a substrate having a first major surface and a second major surface; forming a plurality of light-emitting stacks on the first major surface; forming an etching protection layer on each of the light emitting stacks; forming a plurality of holes by a discontinuous laser beam on the substrate; etching the plurality of holes; and slicing off the substrate along the plurality of holes to form a light emitting device. The light emitting device has a substrate wherein the sidewall of the substrate comprising a first area with a substantially flat surface and a second area with substantially textured surface.Type: ApplicationFiled: July 18, 2013Publication date: November 14, 2013Inventors: Chen Ke HSU, Win Jim SU, Chia-Ming CHUANG, Chen OU
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Patent number: 8492780Abstract: A light emitting device and a method of fabricating thereof are provided. The method of fabricating the light emitting device comprises: providing a substrate having a first major surface and a second major surface; forming a plurality of light-emitting stacks on the first major surface; forming an etching protection layer on each of the light emitting stacks; forming a plurality of holes by a discontinuous laser beam on the substrate; etching the plurality of holes; and slicing off the substrate along the plurality of holes to form a light emitting device. The light emitting device has a substrate wherein the sidewall of the substrate comprising a first area with a substantially flat surface and a second area with substantially textured surface.Type: GrantFiled: February 11, 2010Date of Patent: July 23, 2013Assignee: Epistar CorporationInventors: Chen Ke Hsu, Win Jim Su, Chia-Ming Chuang, Chen Ou
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Publication number: 20110017407Abstract: A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.Type: ApplicationFiled: July 23, 2010Publication date: January 27, 2011Inventors: Chen-Ke Hsu, Liang-Sheng Chi, Chun-Chang Chen, Win-Jim Su, Hsu-Cheng Lin, Mei-Ling Tsai, Yi Lung Liu, Chen Ou
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Publication number: 20100200885Abstract: A light emitting device and a method of fabricating thereof are provided. The method of fabricating the light emitting device comprises: providing a substrate having a first major surface and a second major surface; forming a plurality of light-emitting stacks on the first major surface; forming an etching protection layer on each of the light emitting stacks; forming a plurality of holes by a discontinuous laser beam on the substrate; etching the plurality of holes; and slicing off the substrate along the plurality of holes to form a light emitting device. The light emitting device has a substrate wherein the sidewall of the substrate comprising a first area with a substantially flat surface and a second area with substantially textured surface.Type: ApplicationFiled: February 11, 2010Publication date: August 12, 2010Inventors: Chen Ke HSU, Win Jim Su, Chia-Ming Chuang, Chen Ou
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Patent number: 7256092Abstract: A high-voltage semiconductor MOS process that is fully compatible with low-voltage MOS process is provided. The high-voltage N/P well are implanted into the substrate prior to the definition of active areas. The channel stop doping regions are formed after the formation of field oxide layers, thus avoiding lateral diffusion of the channel stop doping regions. In addition, the grade drive-in process used to activate the grade doping regions in the high-voltage device area and the gate oxide growth of the high-voltage devices are performed simultaneously.Type: GrantFiled: July 25, 2004Date of Patent: August 14, 2007Assignee: United Microelectronics Corp.Inventors: Jung-Ching Chen, Jy-Hwang Lin, Sheng-Hsiung Yang, Jim Su
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Publication number: 20060017114Abstract: A high-voltage semiconductor MOS process that is fully compatible with low-voltage MOS process is provided. The high-voltage N/P well are implanted into the substrate prior to the definition of active areas. The channel stop doping regions are formed after the formation of field oxide layers, thus avoiding lateral diffusion of the channel stop doping regions. In addition, the grade drive-in process used to activate the grade doping regions in the high-voltage device area and the gate oxide growth of the high-voltage devices are performed simultaneously.Type: ApplicationFiled: July 25, 2004Publication date: January 26, 2006Inventors: Jung-Ching Chen, Jy-Hwang Lin, Sheng-Hsiung Yang, Jim SU
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Patent number: 6693043Abstract: A unique photoresist strip sequence using a downstream plasma system is described. The sequence can include a RF directional plasma alone, downstream plasma alone or combine both RF plasma and downstream plasma together. The process sequence can be a single step or multiple steps, which produce high strip rates while maintaining the dielectric properties of the film. The process can be an oxidizing process carried out at low temperature and low pressure, which reduces the reactivity of the oxygen with the low-k film. Furthermore, by adding a small percentage of an additive gas, such as a fluorine-containing gas, to the plasma, the inorganic residues from the strip process are removed, leaving a clean film cleared of photoresist and residue.Type: GrantFiled: September 20, 2002Date of Patent: February 17, 2004Assignee: Novellus Systems, Inc.Inventors: Senzi Li, Helmuth Treichel, Kirk Ostrowski, Chevan Goonetilleke, Jim Su, David L. Chen
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Patent number: 5895937Abstract: A method of etching openings in a dielectric layer of a semiconductor device by utilizing a novel etchant gas system of sulfur hexafluoride/chlorine such that sloped sidewalls can be formed in the openings having a desired taper of between about 20.degree. and about 85.degree. for achieving improved step coverage and profile control of the TFT fabrication process.Type: GrantFiled: October 21, 1997Date of Patent: April 20, 1999Assignee: Applied Komatsu Technology, Inc.Inventors: Yuh-Jia (Jim) Su, Yuen-Kui (Jerry) Wong, Kam S. Law, Haruhiro (Harry) Goto
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Patent number: 5728608Abstract: A method of etching openings in a dielectric layer of a semiconductor device by utilizing a novel etchant gas system of sulfur hexafluoride/chlorine such that sloped sidewalls can be formed in the openings having a desired taper of between about 20.degree. and about 85.degree. for achieving improved step coverage and profile control of the TFT fabrication process.Type: GrantFiled: October 11, 1995Date of Patent: March 17, 1998Assignee: Applied Komatsu Technology, Inc.Inventors: Yuh-Jia (Jim) Su, Yuen-Kui (Jerry) Wong, Kam S. Law, Haruhiro (Harry) Goto
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Patent number: 5657523Abstract: A positioning mechanism of a turret index which performs index rotation by the use of an index mechanism to transmit output shaft motion and perform positioning by a three-piece toothed coupler. The present invention uses a hydraulic system to control the division and the combination of the three-piece toothed coupling to attain the turret's precise positioning and comprises a piston ring on the output shaft. The area of the piston ring's end plane which is subjected to hydraulic pressure, is greater than the area of the slider's end plane inside the three-piece toothed coupler and its end plane is also subjected to hydraulic pressure. At the same time the three-piece toothed coupler is in meshing, the output shaft can obtain an inward pulling force to prevent the output shaft from propping up only a very small distance.Type: GrantFiled: November 2, 1995Date of Patent: August 19, 1997Assignee: Industrial Technology Research InstituteInventors: Ching-Yuan Lin, Win-Jim Su
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Patent number: 5386743Abstract: In a turret indexing device, a coupling containing three gear members is employed in a turret indexing device to cooperate with an indexing disc mounted on an output shaft which is adapted to hold an indexing head. The coupling is operated by a first cam fixedly mounted on an input shaft through a lever mechanism, and the indexing disc is driven by a second cam fixedly mounted on the same input shaft. The three gear members include a first gear member fixedly mounted on a collar slidably mounted on the output shaft, a second gear member which is fixedly mounted on a stationary housing, and third gear member fixedly mounted on a head end of the output shaft.Type: GrantFiled: July 13, 1993Date of Patent: February 7, 1995Assignee: Industrial Technology Research InstituteInventors: Win-Jim Su, Ching-Yuan Lin, Jung-Hong Huang