Abstract: A method for cleaning and polishing a disk is provided. The method includes planarizing the disk and transferring the planarized disk to a first station of a polishing module. At the first station opposing sides of the disk are simultaneously polished as the disk rotates around an axis of the disk. The polishing includes continuously advancing a first polishing member contacting a first surface of the disk and a second polishing member contacting a second surface of the disk, wherein the advancing of the first polishing member independent of the advancing of the second polishing member. The method includes transferring the disk to a second station of the polishing module.