Abstract: A porous filter includes a body including a first body portion and a second body portion, wherein the body includes an outer surface and a length, and wherein the first body portion has a cylindrical shape. An inner channel is formed along the length of the body and includes an open channel end on the outer surface on the first body portion and an internal channel end within the body.

Abstract: A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to the retaining ring. The wafer chuck, inside the cone, is restrained from moving laterally in respect to the cone by the flexure. The wafer, which is supported by the wafer chuck, is moved into the retaining ring by the wafer chuck after the cone has become aligned with the retaining ring. An adjustment mechanism is provided to ensure the co-planar orientation of the wafer and fixture. Other embodiments include a sensor for detecting the presence of the wafer on the chuck, and in the cone, and minimizes particulate contamination to the wafer.

Abstract: A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to the retaining ring. The wafer chuck, inside the cone, is restrained from moving laterally in respect to the cone by the flexure. The wafer, which is supported by the wafer chuck, is moved into the retaining ring by the wafer chuck after the cone has become aligned with the retaining ring. An adjustment mechanism is provided to ensure the co-planar orientation of the wafer and fixture. Other embodiments include a sensor for detecting the presence of the wafer on the chuck, and in the cone, and minimizes particulate contamination to the wafer.

Abstract: A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to the retaining ring. The wafer chuck, inside the cone, is restrained from moving laterally in respect to the cone by the flexure. The wafer, which is supported by the wafer chuck, is moved into the retaining ring by the wafer chuck after the cone has become aligned with the retaining ring. An adjustment mechanism is provided to ensure the co-planar orientation of the wafer and fixture. Other embodiments include a sensor for detecting the presence of the wafer on the chuck, and in the cone, and minimizes particulate contamination to the wafer.

Abstract: A transfer station and concomitant method for a chemical mechanical polishing system comprising a pair of buffer stations and a transport robot. The buffer stations and the ability to transport two wafers simultaneously with the transfer robot minimizes the exchange time for loading and unloading wafers into the chemical mechanical polishing system. The lowering of the exchange time improves the number of wafers processed per hour by the chemical mechanical polishing system. The transfer robot utilizes wafer edge grip features, adjustable wafer gripper force, minimum wafer contact points, fluid media for wafer present sensing, and mechanical interlocking mechanisms to protect both the wafer and the transfer station.

Abstract: A chemical mechanical polishing apparatus has a polishing station, a transfer station, a carrier head to support a substrate, a rotatable carousel supporting the carrier head, a carousel drive shaft coupled to the carousel to rotate the carousel, and a carousel drive system. The carousel is rotatable between a first position in which the carrier head is in the polishing station and a second position in which the carrier head is in the transfer station. The carousel drive system includes a drive motor, a gear reduction box coupled to an output of the drive motor, and a brake system coupling the gear reduction box to the drive shaft.

Abstract: A transfer station and concomitant method for a chemical mechanical polishing system comprising a pair of buffer stations and a transport robot. The buffer stations and the ability to transport two wafers simultaneously with the transfer robot minimizes the exchange time for loading and unloading wafers into the chemical mechanical polishing system. The lowering of the exchange time improves the number of wafers processed per hour by the chemical mechanical polishing system. The transfer robot utilizes wafer edge grip features, adjustable wafer gripper force, minimum wafer contact points, fluid media for wafer present sensing, and mechanical interlocking mechanisms to protect both the wafer and the transfer station.